Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LAPIS Semiconductor Co., Ltd. |
Parts packaging code | SOIC |
package instruction | SOJ, SOP28,.45 |
Contacts | 28 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDSO-J28 |
JESD-609 code | e0 |
length | 18.5 mm |
memory density | 2097152 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOP28,.45 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 2.5 mm |
Maximum standby current | 0.005 A |
Maximum slew rate | 0.04 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8.8 mm |
MSM518221A-40GS-K | MSM518221A-40ZS | MSM518221A-40JS | MSM518221A-25JS | MSM518221A-25ZS | MSM518221A-30GS-K | MSM518221A-30JS | MSM518221A-30ZS | |
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Description | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | SOIC | ZIP | SOJ | SOJ | ZIP | SOIC | SOJ | ZIP |
package instruction | SOJ, SOP28,.45 | ZIP, ZIP28,.1 | SOJ, SOJ28,.44 | SOJ, SOJ28,.44 | ZIP, ZIP28,.1 | SOJ, SOP28,.45 | SOJ, SOJ28,.44 | ZIP, ZIP28,.1 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDSO-J28 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PZIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 18.5 mm | 36 mm | 18.41 mm | 18.41 mm | 36 mm | 18.5 mm | 18.41 mm | 36 mm |
memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | ZIP | SOJ | SOJ | ZIP | SOJ | SOJ | ZIP |
Encapsulate equivalent code | SOP28,.45 | ZIP28,.1 | SOJ28,.44 | SOJ28,.44 | ZIP28,.1 | SOP28,.45 | SOJ28,.44 | ZIP28,.1 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.5 mm | 10.16 mm | 3.75 mm | 3.75 mm | 10.16 mm | 2.5 mm | 3.75 mm | 10.16 mm |
Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
Maximum slew rate | 0.04 mA | 0.04 mA | 0.04 mA | 0.06 mA | 0.06 mA | 0.05 mA | 0.05 mA | 0.05 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8.8 mm | 2.8 mm | 10.16 mm | 10.16 mm | 2.8 mm | 8.8 mm | 10.16 mm | 2.8 mm |
Maker | LAPIS Semiconductor Co., Ltd. | - | - | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |