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MSM518221A-40GS-K

Description
Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28
Categorystorage    storage   
File Size222KB,18 Pages
ManufacturerLAPIS Semiconductor Co., Ltd.
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MSM518221A-40GS-K Overview

Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28

MSM518221A-40GS-K Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLAPIS Semiconductor Co., Ltd.
Parts packaging codeSOIC
package instructionSOJ, SOP28,.45
Contacts28
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-J28
JESD-609 codee0
length18.5 mm
memory density2097152 bit
Memory IC TypeMEMORY CIRCUIT
memory width8
Number of functions1
Number of terminals28
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOP28,.45
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height2.5 mm
Maximum standby current0.005 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.8 mm

MSM518221A-40GS-K Related Products

MSM518221A-40GS-K MSM518221A-40ZS MSM518221A-40JS MSM518221A-25JS MSM518221A-25ZS MSM518221A-30GS-K MSM518221A-30JS MSM518221A-30ZS
Description Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC ZIP SOJ SOJ ZIP SOIC SOJ ZIP
package instruction SOJ, SOP28,.45 ZIP, ZIP28,.1 SOJ, SOJ28,.44 SOJ, SOJ28,.44 ZIP, ZIP28,.1 SOJ, SOP28,.45 SOJ, SOJ28,.44 ZIP, ZIP28,.1
Contacts 28 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDSO-J28 R-PZIP-T28 R-PDSO-J28 R-PDSO-J28 R-PZIP-T28 R-PDSO-J28 R-PDSO-J28 R-PZIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 18.5 mm 36 mm 18.41 mm 18.41 mm 36 mm 18.5 mm 18.41 mm 36 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28 28
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ ZIP SOJ SOJ ZIP SOJ SOJ ZIP
Encapsulate equivalent code SOP28,.45 ZIP28,.1 SOJ28,.44 SOJ28,.44 ZIP28,.1 SOP28,.45 SOJ28,.44 ZIP28,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.5 mm 10.16 mm 3.75 mm 3.75 mm 10.16 mm 2.5 mm 3.75 mm 10.16 mm
Maximum standby current 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.06 mA 0.06 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL ZIG-ZAG DUAL DUAL ZIG-ZAG DUAL DUAL ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8.8 mm 2.8 mm 10.16 mm 10.16 mm 2.8 mm 8.8 mm 10.16 mm 2.8 mm
Maker LAPIS Semiconductor Co., Ltd. - - LAPIS Semiconductor Co., Ltd. LAPIS Semiconductor Co., Ltd. LAPIS Semiconductor Co., Ltd. LAPIS Semiconductor Co., Ltd. LAPIS Semiconductor Co., Ltd.

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