MSM518221A-25ZS datasheet, PDF

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MSM518221A-25ZS: DescriptionMemory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28; Categorystorage storage; File Size222KB，18 Pages; ManufacturerLAPIS Semiconductor Co., Ltd.

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MSM518221A-25ZS Overview

Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28

MSM518221A-25ZS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LAPIS Semiconductor Co., Ltd.
Parts packaging code	ZIP
package instruction	ZIP, ZIP28,.1
Contacts	28
Reach Compliance Code	unknown
JESD-30 code	R-PZIP-T28
JESD-609 code	e0
length	36 mm
memory density	2097152 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	28
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Encapsulate equivalent code	ZIP28,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	10.16 mm
Maximum standby current	0.005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.8 mm

MSM518221A-25ZS Related Products

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Description	Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28	Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28	Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28	Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28	Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28	Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28	Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28	Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	ZIP	ZIP	SOJ	SOJ	SOIC	SOJ	ZIP	SOIC
package instruction	ZIP, ZIP28,.1	ZIP, ZIP28,.1	SOJ, SOJ28,.44	SOJ, SOJ28,.44	SOJ, SOP28,.45	SOJ, SOJ28,.44	ZIP, ZIP28,.1	SOJ, SOP28,.45
Contacts	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PZIP-T28	R-PZIP-T28	R-PDSO-J28	R-PDSO-J28	R-PDSO-J28	R-PDSO-J28	R-PZIP-T28	R-PDSO-J28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	36 mm	36 mm	18.41 mm	18.41 mm	18.5 mm	18.41 mm	36 mm	18.5 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ZIP	ZIP	SOJ	SOJ	SOJ	SOJ	ZIP	SOJ
Encapsulate equivalent code	ZIP28,.1	ZIP28,.1	SOJ28,.44	SOJ28,.44	SOP28,.45	SOJ28,.44	ZIP28,.1	SOP28,.45
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	10.16 mm	10.16 mm	3.75 mm	3.75 mm	2.5 mm	3.75 mm	10.16 mm	2.5 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Maximum slew rate	0.06 mA	0.04 mA	0.04 mA	0.06 mA	0.05 mA	0.05 mA	0.05 mA	0.04 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND	J BEND	THROUGH-HOLE	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	2.8 mm	2.8 mm	10.16 mm	10.16 mm	8.8 mm	10.16 mm	2.8 mm	8.8 mm
Maker	LAPIS Semiconductor Co., Ltd.	-	-	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.	LAPIS Semiconductor Co., Ltd.

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