Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LAPIS Semiconductor Co., Ltd. |
| Parts packaging code | ZIP |
| package instruction | ZIP, ZIP28,.1 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PZIP-T28 |
| JESD-609 code | e0 |
| length | 36 mm |
| memory density | 2097152 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP28,.1 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 10.16 mm |
| Maximum standby current | 0.005 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 2.8 mm |
| MSM518221A-30ZS | MSM518221A-40ZS | MSM518221A-40JS | MSM518221A-25JS | MSM518221A-25ZS | MSM518221A-30GS-K | MSM518221A-30JS | MSM518221A-40GS-K | |
|---|---|---|---|---|---|---|---|---|
| Description | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PZIP28, 0.400 INCH HEIGHT, 1.27 MM PITCH, PLASTIC, ZIP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Memory Circuit, 256KX8, CMOS, PDSO28, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | ZIP | ZIP | SOJ | SOJ | ZIP | SOIC | SOJ | SOIC |
| package instruction | ZIP, ZIP28,.1 | ZIP, ZIP28,.1 | SOJ, SOJ28,.44 | SOJ, SOJ28,.44 | ZIP, ZIP28,.1 | SOJ, SOP28,.45 | SOJ, SOJ28,.44 | SOJ, SOP28,.45 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PZIP-T28 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 36 mm | 36 mm | 18.41 mm | 18.41 mm | 36 mm | 18.5 mm | 18.41 mm | 18.5 mm |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | ZIP | ZIP | SOJ | SOJ | ZIP | SOJ | SOJ | SOJ |
| Encapsulate equivalent code | ZIP28,.1 | ZIP28,.1 | SOJ28,.44 | SOJ28,.44 | ZIP28,.1 | SOP28,.45 | SOJ28,.44 | SOP28,.45 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 10.16 mm | 10.16 mm | 3.75 mm | 3.75 mm | 10.16 mm | 2.5 mm | 3.75 mm | 2.5 mm |
| Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| Maximum slew rate | 0.05 mA | 0.04 mA | 0.04 mA | 0.06 mA | 0.06 mA | 0.05 mA | 0.05 mA | 0.04 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 2.8 mm | 2.8 mm | 10.16 mm | 10.16 mm | 2.8 mm | 8.8 mm | 10.16 mm | 8.8 mm |
| Maker | LAPIS Semiconductor Co., Ltd. | - | - | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
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