CD54HCT4052F datasheet, PDF - EEWORLD Datasheet

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CD54HCT4052F: DescriptionIC,ANALOG MUX,SINGLE,4-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC; CategoryAnalog mixed-signal IC The signal circuit; File Size652KB，9 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD54HCT4052F Overview

IC,ANALOG MUX,SINGLE,4-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC

CD54HCT4052F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
Factory Lead Time	1 week
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of channels	4
Number of functions	1
Number of terminals	16
Maximum on-state resistance (Ron)	270 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5,GND/-5 V
Certification status	Not Qualified
Maximum signal current	0.025 A
Maximum supply current (Isup)	0.32 mA
surface mount	NO
Maximum connection time	70 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

CD54HCT4052F Related Products

	CD54HCT4052F	CD54HC4051H	CD54HC4052H	CD54HCT4051H	CD54HCT4053F	CD54HCT4051F	CD54HC4052F	CD54HC4053F	5962-01-318-3767
Description	IC,ANALOG MUX,SINGLE,4-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC	CD54HC4051H	CD54HC4052H	CD54HCT4051H	CD54HCT4053F	IC,ANALOG MUX,SINGLE,8-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC	DIFFERENTIAL MULTIPLEXER	SGL ENDED MULTIPLEXER	IC,ANALOG MUX,SINGLE,4-CHANNEL,HC-CMOS,DIP,16PIN,CERAMIC
Reach Compliance Code	not_compliant	unknown	unknown	unknown	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Number of channels	4	8	4	8	2	8	4	2	4
Number of functions	1	1	1	1	3	1	1	3	1
Maximum on-state resistance (Ron)	270 Ω	270 Ω	270 Ω	270 Ω	270 Ω	270 Ω	270 Ω	270 Ω	270 Ω
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Encapsulate equivalent code	DIP16,.3	DIE OR CHIP	DIE OR CHIP	DIE OR CHIP	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
power supply	5,GND/-5 V	2/6,GND/-6 V	2/6,GND/-6 V	5,GND/-5 V	5,GND/-5 V	5,GND/-5 V	2/6,GND/-6 V	2/6,GND/-6 V	2/6,GND/-6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum signal current	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A
Maximum connection time	70 ns	45 ns	65 ns	55 ns	48 ns	55 ns	65 ns	44 ns	65 ns
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Is it Rohs certified?	incompatible	-	-	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3	-	-	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
JESD-30 code	R-XDIP-T16	-	-	-	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	-	-	-	e0	e0	e0	e0	-
Number of terminals	16	-	-	-	16	16	16	16	16
Package body material	CERAMIC	-	-	-	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	-	-	-	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	-	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	-	-	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Maximum supply current (Isup)	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	-	-	-
surface mount	NO	-	-	-	NO	NO	NO	NO	NO
Terminal surface	Tin/Lead (Sn/Pb)	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	-	-	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	-	-	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	-	-	-	DUAL	DUAL	DUAL	DUAL	DUAL
Analog Integrated Circuits - Other Types	-	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	-	-	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	-

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