CD54HCT4051H
Parameter Name | Attribute value |
Maker | Renesas Electronics Corporation |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
Number of channels | 8 |
Number of functions | 1 |
Maximum on-state resistance (Ron) | 270 Ω |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Encapsulate equivalent code | DIE OR CHIP |
power supply | 5,GND/-5 V |
Certification status | Not Qualified |
Maximum signal current | 0.025 A |
Maximum supply current (Isup) | 0.32 mA |
Maximum connection time | 55 ns |
switch | BREAK-BEFORE-MAKE |
technology | CMOS |
Temperature level | MILITARY |
CD54HCT4051H | CD54HC4051H | CD54HC4052H | CD54HCT4052F | CD54HCT4053F | CD54HCT4051F | CD54HC4052F | CD54HC4053F | 5962-01-318-3767 | |
---|---|---|---|---|---|---|---|---|---|
Description | CD54HCT4051H | CD54HC4051H | CD54HC4052H | IC,ANALOG MUX,SINGLE,4-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC | CD54HCT4053F | IC,ANALOG MUX,SINGLE,8-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC | DIFFERENTIAL MULTIPLEXER | SGL ENDED MULTIPLEXER | IC,ANALOG MUX,SINGLE,4-CHANNEL,HC-CMOS,DIP,16PIN,CERAMIC |
Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
Number of channels | 8 | 8 | 4 | 4 | 2 | 8 | 4 | 2 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 3 | 1 | 1 | 3 | 1 |
Maximum on-state resistance (Ron) | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
power supply | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum signal current | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
Maximum connection time | 55 ns | 45 ns | 65 ns | 70 ns | 48 ns | 55 ns | 65 ns | 44 ns | 65 ns |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Maker | Renesas Electronics Corporation | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | - | - | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - |
Maximum supply current (Isup) | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | - | - | - |
Is it Rohs certified? | - | - | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | - | - | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
JESD-30 code | - | - | - | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609 code | - | - | - | e0 | e0 | e0 | e0 | e0 | - |
Number of terminals | - | - | - | 16 | 16 | 16 | 16 | 16 | 16 |
Package body material | - | - | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | - | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
Package shape | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
surface mount | - | - | - | NO | NO | NO | NO | NO | NO |
Terminal surface | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | - | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |