CD4023UBD datasheet, PDF - EEWORLD Datasheet

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CD4023UBD: DescriptionIC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC; Categorylogic logic; File Size800KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4023UBD Overview

IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC

CD4023UBD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T14
Logic integrated circuit type	NAND GATE
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

CD4023UBD Related Products

	CD4023UBD	CD4012UBD	CD4012UBD3	CD4012UBE	CD4012UBF3A	CD4023UBE	CD4023UBF	CD4023UBJ/3
Description	IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,14PIN,CERAMIC	CD4012UBD3	IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,14PIN,PLASTIC	CD4012UBF3A	IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,PLASTIC	IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC	IC,LOGIC GATE,3 3-INPUT NAND,CMOS,LLCC,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	QCCN, LCC20,.35SQ
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	S-XQCC-N20
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of terminals	14	14	14	14	14	14	14	20
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	QCCN
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	LCC20,.35SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO
surface mount	NO	NO	NO	NO	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD

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