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CD4012UBD3

Description
CD4012UBD3
Categorylogic    logic   
File Size800KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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CD4012UBD3 Overview

CD4012UBD3

CD4012UBD3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP14,.3
Reach Compliance Codenot_compliant
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Certification statusNot Qualified
Schmitt triggerNO
Filter level38535Q/M;38534H;883B
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

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CD4012UBD3 CD4012UBD CD4012UBE CD4012UBF3A CD4023UBD CD4023UBE CD4023UBF CD4023UBJ/3
Description CD4012UBD3 IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,14PIN,CERAMIC IC,LOGIC GATE,DUAL 4-INPUT NAND,CMOS,DIP,14PIN,PLASTIC CD4012UBF3A IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,PLASTIC IC,LOGIC GATE,3 3-INPUT NAND,CMOS,DIP,14PIN,CERAMIC IC,LOGIC GATE,3 3-INPUT NAND,CMOS,LLCC,20PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 QCCN, LCC20,.35SQ
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 S-XQCC-N20
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 14 14 14 14 14 14 20
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 125 °C 85 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -40 °C -55 °C -55 °C -40 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP QCCN
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 LCC20,.35SQ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO NO
surface mount NO NO NO NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL MILITARY MILITARY INDUSTRIAL MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL QUAD

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