MR25H256CDC datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> MR25H256CDC

MR25H256CDC: DescriptionMemory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8; Categorystorage storage; File Size2MB，24 Pages; ManufacturerEverspin Technologies; Environmental Compliance

Download Datasheet Parametric Compare View All

MR25H256CDC Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	MR25H256CDC	-	-	View	Buy Now

MR25H256CDC Overview

Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8

MR25H256CDC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	SON
package instruction	HSON, SOLCC8,.25
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-N8
length	6 mm
memory density	262144 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	N/A
Number of functions	1
Number of terminals	8
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HSON
Encapsulate equivalent code	SOLCC8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	1.05 mm
Maximum standby current	0.00001 A
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm

MR25H256CDC Related Products

	MR25H256CDC	MR25H256CDCR	MR25H256CDF	MR25H256MDC
Description	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229-E, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies
package instruction	HSON, SOLCC8,.25	HSON, SOLCC8,.25	HVSON,	HSON, SOLCC8,.25
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8
length	6 mm	6 mm	6 mm	6 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HSON	HSON	HVSON	HSON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	1.05 mm	1.05 mm	0.9 mm	1.05 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	3 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	5 mm	5 mm	5 mm	5 mm
Parts packaging code	SON	SON	-	SON
Contacts	8	8	-	8
Mixed memory types	N/A	N/A	-	N/A
Encapsulate equivalent code	SOLCC8,.25	SOLCC8,.25	-	SOLCC8,.25
power supply	3/3.3 V	3/3.3 V	-	3/3.3 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified
Maximum standby current	0.00001 A	0.00001 A	-	0.00001 A

Recommended Resources

Based on NFC universal card reader circuit diagram

MAX1516 charge pump driver circuit diagram

High voltage generator excitation group overvoltage protection circuit

One of multiple sets of high-power colored light chain circuits that flash in turn a

Pulse generator circuit with separately adjustable duty cycle and frequency

Inverting dual triangle wave oscillator

(Extra 2) GD32L233 Evaluation-Development Environment Construction (Basic Framework + FreeRTOS + Compilation Passed): [i=s] This post was last edited by Yunhu Congbai on 2022-1-14 10:20 [/i] ## Preface The board has not been received yet. Let's get the compilation environment done first, and then merge M23 into my M-...; 韵湖葱白 GD32 MCU

Hardware structure of TMS320C55x: 1.1C55x CPU system C55x has one 32-bit program data bus (PB), five 16-bit data buses (BB, CB, DB, EB, FB), one 24-bit program address bus and five 23-bit data address buses, which are connected to the...; Jacktang Microcontroller MCU

Experience sharing on software management in the field of engine control in the automotive industry: For the automotive industry engine control field, there is currently no systematic structure for software development management. I would like to ask people with relevant experience to share with me. ...; 853713562 Automotive Electronics

Antenna Principles (Harbin Institute of Technology): This course is a required course for undergraduate students majoring in electronic information. The content includes: basic concepts and basic theories of antennas; basic working principles of common ...; EE大学堂 Training Edition

Xunwei iMX6 development board-device tree kernel-register device routine: This document mainly explains how to add device tree statements in the device tree file "arch/arm/boot/dts/imx6qdl-sabresd.dtsi" to register a device in the device tree kernel (4.1.15) source code of ...; 遥寄山川 ARM Technology

[RPi PICO] Using inline assembly to implement trigger ADC sampling and register viewing: Original post: https://forum.micropython.org/viewtopic.php?t=9910p=55444It looks at the hardware registers and provides samples at adc0. It puts the data into the buffer at a given frequency (up to 50...; dcexpert MicroPython Open Source section

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components