MR25H256CDF datasheet, PDF - EEWORLD Datasheet

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MR25H256CDF: DescriptionMemory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229-E, DFN-8; Categorystorage storage; File Size2MB，24 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR25H256CDF Overview

Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229-E, DFN-8

MR25H256CDF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
package instruction	HVSON,
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDSO-N8
length	6 mm
memory density	262144 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	8
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	0.9 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm

MR25H256CDF Related Products

	MR25H256CDF	MR25H256CDCR	MR25H256CDC	MR25H256MDC
Description	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229-E, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8	Memory Circuit, 32KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies
package instruction	HVSON,	HSON, SOLCC8,.25	HSON, SOLCC8,.25	HSON, SOLCC8,.25
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8
length	6 mm	6 mm	6 mm	6 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	HSON	HSON	HSON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE, HEAT SINK/SLUG	SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	0.9 mm	1.05 mm	1.05 mm	1.05 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	3 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	5 mm	5 mm	5 mm	5 mm
Parts packaging code	-	SON	SON	SON
Contacts	-	8	8	8
Mixed memory types	-	N/A	N/A	N/A
Encapsulate equivalent code	-	SOLCC8,.25	SOLCC8,.25	SOLCC8,.25
power supply	-	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	-	0.00001 A	0.00001 A	0.00001 A

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