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M27C1024-12XF7

Description
64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Categorystorage    storage   
File Size279KB,15 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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M27C1024-12XF7 Overview

64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40

M27C1024-12XF7 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionWINDOWED, FRIT SEALED, CERAMIC, DIP-40
Contacts40
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T40
JESD-609 codee3
length52.195 mm
memory density1048576 bit
Memory IC TypeUVPROM
memory width16
Number of functions1
Number of terminals40
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
organize64KX16
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.97 mm
Maximum standby current0.0001 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
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