High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Motorola ( NXP ) |
Parts packaging code | DIP |
package instruction | SDIP, SDIP42,.6 |
Contacts | 42 |
Reach Compliance Code | unknow |
Has ADC | YES |
Address bus width | |
bit size | 8 |
CPU series | 6805 |
maximum clock frequency | 4.2 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | R-PDIP-T42 |
JESD-609 code | e0 |
length | 36.83 mm |
Number of I/O lines | 13 |
Number of terminals | 42 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | SDIP |
Encapsulate equivalent code | SDIP42,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 96 |
rom(word) | 1792 |
ROM programmability | MROM |
Maximum seat height | 5.08 mm |
speed | 2.1 MHz |
Maximum slew rate | 10 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | HCMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.778 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
MC68HC05L2CB | MC68HC705L2B | MC68HC705L2CB | MC68HC705L2K | |
---|---|---|---|---|
Description | High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit | High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit | High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit | High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | SDIP, SDIP42,.6 | SDIP, | SDIP, | DIP, |
Reach Compliance Code | unknow | unknow | unknow | unknown |
Has ADC | YES | YES | YES | YES |
bit size | 8 | 8 | 8 | 8 |
maximum clock frequency | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz |
DAC channel | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO |
JESD-30 code | R-PDIP-T42 | R-PDIP-T42 | R-PDIP-T42 | R-CDIP-T42 |
JESD-609 code | e0 | e0 | e0 | e0 |
Number of I/O lines | 13 | 13 | 13 | 13 |
Number of terminals | 42 | 42 | 42 | 42 |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C |
PWM channel | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | SDIP | SDIP | SDIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM programmability | MROM | OTPROM | OTPROM | UVPROM |
speed | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz |
Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | HCMOS | HCMOS | HCMOS | HCMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Parts packaging code | DIP | DIP | DIP | - |
Contacts | 42 | 42 | 42 | - |
length | 36.83 mm | 36.83 mm | 36.83 mm | - |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | - |
Terminal pitch | 1.778 mm | 1.778 mm | 1.778 mm | - |
width | 15.24 mm | 15.24 mm | 15.24 mm | - |