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MC68HC705L2K

Description
High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size7MB,110 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MC68HC705L2K Overview

High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit

MC68HC705L2K Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionDIP,
Reach Compliance Codeunknown
Has ADCYES
Address bus width
bit size8
maximum clock frequency4.2 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-CDIP-T42
JESD-609 codee0
Number of I/O lines13
Number of terminals42
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
ROM programmabilityUVPROM
speed2.1 MHz
Maximum slew rate10 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyHCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
For More Information On This Product,
Go to: www.freescale.com

MC68HC705L2K Related Products

MC68HC705L2K MC68HC05L2CB MC68HC705L2B MC68HC705L2CB
Description High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction DIP, SDIP, SDIP42,.6 SDIP, SDIP,
Reach Compliance Code unknown unknow unknow unknow
Has ADC YES YES YES YES
bit size 8 8 8 8
maximum clock frequency 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz
DAC channel NO NO NO NO
DMA channel NO NO NO NO
JESD-30 code R-CDIP-T42 R-PDIP-T42 R-PDIP-T42 R-PDIP-T42
JESD-609 code e0 e0 e0 e0
Number of I/O lines 13 13 13 13
Number of terminals 42 42 42 42
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C
PWM channel NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SDIP SDIP SDIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
ROM programmability UVPROM MROM OTPROM OTPROM
speed 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz
Maximum slew rate 10 mA 10 mA 10 mA 10 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology HCMOS HCMOS HCMOS HCMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Parts packaging code - DIP DIP DIP
Contacts - 42 42 42
length - 36.83 mm 36.83 mm 36.83 mm
Maximum seat height - 5.08 mm 5.08 mm 5.08 mm
Terminal pitch - 1.778 mm 1.778 mm 1.778 mm
width - 15.24 mm 15.24 mm 15.24 mm

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