Operational Amplifier, 2 Func, 7500uV Offset-Max, BIPolar, PDSO8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 0.5 µA |
| frequency compensation | YES |
| Maximum input offset voltage | 7500 µV |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Humidity sensitivity level | 3 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Maximum slew rate | 5.6 mA |
| Supply voltage upper limit | 18 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| Minimum voltage gain | 15000 |
| MC1458ID | MC1458D | MC1458S | MC1458N | |
|---|---|---|---|---|
| Description | Operational Amplifier, 2 Func, 7500uV Offset-Max, BIPolar, PDSO8 | Operational Amplifier, 2 Func, 7500uV Offset-Max, BIPolar, PDSO8 | Operational Amplifier, 2 Func, 7500uV Offset-Max, BIPolar | Operational Amplifier, 2 Func, 7500uV Offset-Max, BIPolar, PDIP8 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Parts packaging code | SOIC | SOIC | SIP | DIP |
| Contacts | 8 | 8 | 9 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 0.5 µA | 0.5 µA | 0.5 µA | 0.5 µA |
| frequency compensation | YES | YES | YES | YES |
| Maximum input offset voltage | 7500 µV | 7500 µV | 7500 µV | 7500 µV |
| JESD-609 code | e0 | e0 | e0 | e0 |
| low-dissonance | NO | NO | NO | NO |
| Humidity sensitivity level | 3 | 3 | 3 | 3 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V |
| Number of functions | 2 | 2 | 2 | 2 |
| Number of terminals | 8 | 8 | 9 | 8 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | SIP9,.1 | DIP8,.3 |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 5.6 mA | 5.6 mA | 5.6 mA | 5.6 mA |
| Supply voltage upper limit | 18 V | 18 V | 18 V | 18 V |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V |
| surface mount | YES | YES | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | OTHER | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | SINGLE | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 |
| Minimum voltage gain | 15000 | 15000 | 15000 | 15000 |
| package instruction | SOP, SOP8,.25 | - | , SIP9,.1 | DIP, DIP8,.3 |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | - | R-PDIP-T8 |
| encapsulated code | SOP | SOP | - | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | - | IN-LINE |
| Terminal form | GULL WING | GULL WING | - | THROUGH-HOLE |
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