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TSI107D-133LE

Description
PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size381KB,54 Pages
ManufacturerTundra Semiconductor Corp
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TSI107D-133LE Overview

PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503

TSI107D-133LE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTundra Semiconductor Corp
package instruction33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Reach Compliance Codeunknown
Address bus width32
Bus compatibilityPOWERPC 60X
maximum clock frequency66 MHz
External data bus width64
JESD-30 codeS-PBGA-B503
JESD-609 codee0
length33 mm
Humidity sensitivity level3
Number of terminals503
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.75 mm
Maximum supply voltage2.625 V
Minimum supply voltage2.375 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width33 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Tsi107
Hardware Specification
TitlePage - 80C2000_MA002_06
Document Number: 80C2000_MA002_06
Document Status: Formal
Revision Date: January 2007
Tundra Semiconductor Corporation

TSI107D-133LE Related Products

TSI107D-133LE TSI107D-66JEY TSI107D-100JEY TSI107D-100JE TSI107C-100JE TSI107D-133LEY TSI107D-66JE
Description PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503 PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, FLIP CHIP, BGA-503 PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503 PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Is it Rohs certified? incompatible conform to conform to incompatible incompatible conform to incompatible
package instruction 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503 BGA, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503 BGA, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
Address bus width 32 32 32 32 32 32 32
Bus compatibility POWERPC 60X PCI; I2C; 60X PROCESSOR POWERPC 60X POWERPC 60X POWERPC 60X PCI; I2C; 60X PROCESSOR POWERPC 60X
maximum clock frequency 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz
External data bus width 64 64 64 64 64 64 64
JESD-30 code S-PBGA-B503 S-PBGA-B503 S-PBGA-B503 S-PBGA-B503 S-PBGA-B503 S-PBGA-B503 S-PBGA-B503
length 33 mm 33 mm 33 mm 33 mm 33 mm 33 mm 33 mm
Number of terminals 503 503 503 503 503 503 503
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.75 mm 2.75 mm 2.75 mm 2.75 mm 2.75 mm 2.75 mm 2.75 mm
Maximum supply voltage 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 33 mm 33 mm 33 mm 33 mm 33 mm 33 mm 33 mm
Maker Tundra Semiconductor Corp - Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp
JESD-609 code e0 - e1 e0 - e1 -
Humidity sensitivity level 3 - 3 3 - 3 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED - 260 225 - NOT SPECIFIED -
Terminal surface TIN LEAD - Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD - Tin/Silver/Copper (Sn/Ag/Cu) -
Maximum time at peak reflow temperature NOT SPECIFIED - 40 30 - NOT SPECIFIED -
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI - BUS CONTROLLER, PCI
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