TSI107C-100JE datasheet, PDF - EEWORLD Datasheet

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TSI107C-100JE: DescriptionPCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503; CategoryThe embedded processor and controller Microcontrollers and processors; File Size381KB，54 Pages; ManufacturerTundra Semiconductor Corp

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TSI107C-100JE Overview

PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503

TSI107C-100JE Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Tundra Semiconductor Corp
package instruction	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Reach Compliance Code	unknown
Address bus width	32
Bus compatibility	POWERPC 60X
maximum clock frequency	66 MHz
External data bus width	64
JESD-30 code	S-PBGA-B503
length	33 mm
Number of terminals	503
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	2.75 mm
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	33 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI

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Tsi107

™

Hardware Specification

TitlePage - 80C2000_MA002_06

Document Number: 80C2000_MA002_06

Document Status: Formal

Revision Date: January 2007

Tundra Semiconductor Corporation

Trademarks

TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S., and U.K.). TUNDRA,

the Tundra logo, Tsi107, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.

All other registered and unregistered marks (including trademarks, service marks and logos) are the property of

their respective owners. The absence of a mark identifier is not a representation that a particular product name is

not a mark.

Published in Canada

This document contains information that is proprietary to Tundra and may be used for non-commercial purposes

within your organization in support of Tundra products. No other use or transmission of all or any part of this

document is permitted without written permission from Tundra, and must include all copyright and other

proprietary notices. Use or transmission of all or any part of this document in violation of any applicable

Canadian or other legislation is hereby expressly prohibited. User obtains no rights in the information or in any

product, process, technology or trademark which it includes or describes, and is expressly prohibited from

modifying the information or creating derivative works without the express written consent of Tundra.

Disclaimer

Tundra assumes no responsibility for the accuracy or completeness of the information presented, which is subject

to change without notice. Tundra products may contain design defects or errors known as errata which may cause

the product to deviate from published specifications. Current characterized errata are available on request. In no

event will Tundra be liable for any direct, indirect, special, incidental or consequential damages, including lost

profits, lost business or lost data, resulting from the use of or reliance upon the information, whether or not

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not affect or change Tundra’s product warranties.

Mention of non-Tundra products or services is for information purposes only and constitutes neither an

endorsement nor a recommendation.

TSI107C-100JE Related Products

	TSI107C-100JE	TSI107D-66JEY	TSI107D-100JEY	TSI107D-100JE	TSI107D-133LE	TSI107D-133LEY	TSI107D-66JE
Description	PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503	PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, FLIP CHIP, BGA-503	PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503	PCI Bus Controller, CMOS, PBGA503, 33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Is it Rohs certified?	incompatible	conform to	conform to	incompatible	incompatible	conform to	incompatible
package instruction	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-503	BGA,	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503	BGA,	33 X 33 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-503
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Address bus width	32	32	32	32	32	32	32
Bus compatibility	POWERPC 60X	PCI; I2C; 60X PROCESSOR	POWERPC 60X	POWERPC 60X	POWERPC 60X	PCI; I2C; 60X PROCESSOR	POWERPC 60X
maximum clock frequency	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz
External data bus width	64	64	64	64	64	64	64
JESD-30 code	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503	S-PBGA-B503
length	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm
Number of terminals	503	503	503	503	503	503	503
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.75 mm	2.75 mm	2.75 mm	2.75 mm	2.75 mm	2.75 mm	2.75 mm
Maximum supply voltage	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm	33 mm
Maker	Tundra Semiconductor Corp	-	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp	Tundra Semiconductor Corp
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	-	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	-	BUS CONTROLLER, PCI
JESD-609 code	-	-	e1	e0	e0	e1	-
Humidity sensitivity level	-	-	3	3	3	3	-
Peak Reflow Temperature (Celsius)	-	-	260	225	NOT SPECIFIED	NOT SPECIFIED	-
Terminal surface	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD	TIN LEAD	Tin/Silver/Copper (Sn/Ag/Cu)	-
Maximum time at peak reflow temperature	-	-	40	30	NOT SPECIFIED	NOT SPECIFIED	-

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