Power Management Circuit, CMOS, PDIP8, DIP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| package instruction | DIP-8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MAX8211CPA-2 | MAX8212CTY/HR | MAX8212ETV | MAX8211CSA2 | MAX8212CPA-2 | MAX8212CSA2 | MAX8212MJA/HR | |
|---|---|---|---|---|---|---|---|
| Description | Power Management Circuit, CMOS, PDIP8, DIP-8 | Power Management Circuit, CMOS, MBCY8 | Power Management Circuit, CMOS, MBCY8 | Power Management Circuit, CMOS, PDSO8 | Power Management Circuit, CMOS, PDIP8, DIP-8 | Power Management Circuit, CMOS, PDSO8 | Power Management Circuit, CMOS, CDIP8 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T8 | O-MBCY-W8 | O-MBCY-W8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-XDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| Encapsulate equivalent code | DIP8,.3 | CAN8,.2 | CAN8,.2 | SOP8,.25 | DIP8,.3 | SOP8,.25 | DIP8,.3 |
| Package shape | RECTANGULAR | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | WIRE | WIRE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal location | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL |
| encapsulated code | DIP | - | - | SOP | DIP | SOP | DIP |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | - | - | YES | NO | YES | NO |
| Terminal pitch | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Maximum supply current (Isup) | - | - | 0.02 mA | 0.02 mA | - | 0.02 mA | 0.02 mA |
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