MAX8212CPA-2 datasheet, PDF - EEWORLD Datasheet

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MAX8212CPA-2: DescriptionPower Management Circuit, CMOS, PDIP8, DIP-8; CategoryPower/power management The power supply circuit; File Size529KB，8 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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MAX8212CPA-2 Overview

Power Management Circuit, CMOS, PDIP8, DIP-8

MAX8212CPA-2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Maxim
package instruction	DIP, DIP8,.3
Reach Compliance Code	not_compliant
ECCN code	EAR99
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MAX8212CPA-2 Related Products

	MAX8212CPA-2	MAX8212CTY/HR	MAX8212ETV	MAX8211CPA-2	MAX8211CSA2	MAX8212CSA2	MAX8212MJA/HR
Description	Power Management Circuit, CMOS, PDIP8, DIP-8	Power Management Circuit, CMOS, MBCY8	Power Management Circuit, CMOS, MBCY8	Power Management Circuit, CMOS, PDIP8, DIP-8	Power Management Circuit, CMOS, PDSO8	Power Management Circuit, CMOS, PDSO8	Power Management Circuit, CMOS, CDIP8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Maxim	Maxim	Maxim	Maxim	Maxim	Maxim	Maxim
Reach Compliance Code	not_compliant	_compli	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T8	O-MBCY-W8	O-MBCY-W8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-XDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	125 °C
Package body material	PLASTIC/EPOXY	METAL	METAL	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
Encapsulate equivalent code	DIP8,.3	CAN8,.2	CAN8,.2	DIP8,.3	SOP8,.25	SOP8,.25	DIP8,.3
Package shape	RECTANGULAR	ROUND	ROUND	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CYLINDRICAL	CYLINDRICAL	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	WIRE	WIRE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal location	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL
encapsulated code	DIP	-	-	DIP	SOP	SOP	DIP
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	-	-	NO	YES	YES	NO
Terminal pitch	2.54 mm	-	-	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Maximum supply current (Isup)	-	-	0.02 mA	-	0.02 mA	0.02 mA	0.02 mA

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