DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 144 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Other features | AUTO/SELF REFRESH |
JESD-30 code | S-PBGA-B144 |
length | 13 mm |
memory density | 134217728 bit |
Memory IC Type | DDR DRAM |
memory width | 32 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | SYNCHRONOUS |
organize | 4MX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 2.6 V |
Minimum supply voltage (Vsup) | 2.4 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 13 mm |
K4N26323AE-GC220 | K4N26323AE-GC250 | K4N26323AE-GC200 | |
---|---|---|---|
Description | DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144 | DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144 | DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144 |
Maker | SAMSUNG | SAMSUNG | SAMSUNG |
Parts packaging code | BGA | BGA | BGA |
package instruction | LFBGA, | LFBGA, | LFBGA, |
Contacts | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
length | 13 mm | 13 mm | 13 mm |
memory density | 134217728 bit | 134217728 bit | 134217728 bit |
Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM |
memory width | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 |
word count | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
organize | 4MX32 | 4MX32 | 4MX32 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | LFBGA | LFBGA |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.4 mm | 1.4 mm | 1.4 mm |
self refresh | YES | YES | YES |
Maximum supply voltage (Vsup) | 2.6 V | 2.6 V | 2.6 V |
Minimum supply voltage (Vsup) | 2.4 V | 2.4 V | 2.4 V |
Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Terminal form | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
width | 13 mm | 13 mm | 13 mm |