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K4N26323AE-GC200

Description
DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144
Categorystorage    storage   
File Size825KB,52 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K4N26323AE-GC200 Overview

DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144

K4N26323AE-GC200 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionLFBGA,
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeS-PBGA-B144
length13 mm
memory density134217728 bit
Memory IC TypeDDR DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals144
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
organize4MX32
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.4 mm
self refreshYES
Maximum supply voltage (Vsup)2.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width13 mm

K4N26323AE-GC200 Related Products

K4N26323AE-GC200 K4N26323AE-GC250 K4N26323AE-GC220
Description DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144 DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144 DDR DRAM, 4MX32, CMOS, PBGA144, FBGA-144
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code BGA BGA BGA
package instruction LFBGA, LFBGA, LFBGA,
Contacts 144 144 144
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
length 13 mm 13 mm 13 mm
memory density 134217728 bit 134217728 bit 134217728 bit
Memory IC Type DDR DRAM DDR DRAM DDR DRAM
memory width 32 32 32
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 144 144 144
word count 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
organize 4MX32 4MX32 4MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.4 mm 1.4 mm 1.4 mm
self refresh YES YES YES
Maximum supply voltage (Vsup) 2.6 V 2.6 V 2.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 13 mm 13 mm 13 mm
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