K9F1G08U0A-FCB00 datasheet, PDF

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K9F1G08U0A-FCB00: DescriptionFlash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48; Categorystorage storage; File Size873KB，36 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K9F1G08U0A-FCB00 Overview

Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48

K9F1G08U0A-FCB00 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	SOIC
package instruction	12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	18 ns
Other features	CONTAINS ADDITIONAL 32M BIT NAND FLASH
command user interface	YES
Data polling	NO
JESD-30 code	R-PDSO-G48
length	15.4 mm
memory density	1073741824 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	1K
Number of terminals	48
word count	134217728 words
character code	128000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX8
Package body material	PLASTIC/EPOXY
encapsulated code	VSSOP
Encapsulate equivalent code	TSSOP48,.71,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
page size	2K words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	0.7 mm
Department size	128K
Maximum standby current	0.00005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	SLC NAND TYPE
width	12 mm

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K9F1G08R0A

K9F1G08U0A K9K2G08U1A

Preliminary

FLASH MEMORY

Document Title

128M x 8 Bit / 256M x 8 Bit

NAND Flash Memory

Revision History

Revision No

0.0

0.1

History

1. Initial issue

1. The tADL(Address to Data Loading Time) is added.

- tADL Minimum 100ns (Page 11, 23~26)

- tADL is the time from the WE rising edge of final address cycle

to the WE rising edge of first data cycle at program operation.

2. Added Addressing method for program operation

Draft Date

Aug. 24. 2003

Jan. 27. 2004

Remark

Advance

Preliminary

0.2

0.3

0.4

1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.

1. PKG(TSOP1, WSOP1) Dimension Change

1. Technical note is changed

2. Notes of AC timing characteristics are added

3. The description of Copy-back program is changed

4. Voltage range is changed

-1.7V~1.95V -> 1.65V~1.95V

5. Note2 of Command Sets is added

1. CE access time : 23ns->35ns (p.11)

Apr. 23. 2004

May. 19. 2004

Jan. 21. 2005

Preliminary

Feb. 14. 2005

0.5

Preliminary

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right

to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have

any questions, please contact the SAMSUNG branch office near your office.

K9F1G08U0A-FCB00 Related Products

	K9F1G08U0A-FCB00	K9F1G08U0A-VCB00
Description	Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48	Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48
Maker	SAMSUNG	SAMSUNG
Parts packaging code	SOIC	SOIC
package instruction	12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48	12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48
Contacts	48	48
Reach Compliance Code	compliant	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A
Maximum access time	18 ns	18 ns
Other features	CONTAINS ADDITIONAL 32M BIT NAND FLASH	CONTAINS ADDITIONAL 32M BIT NAND FLASH
JESD-30 code	R-PDSO-G48	R-PDSO-G48
length	15.4 mm	15.4 mm
memory density	1073741824 bit	1073741824 bit
Memory IC Type	FLASH	FLASH
memory width	8	8
Number of functions	1	1
Number of terminals	48	48
word count	134217728 words	134217728 words
character code	128000000	128000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	128MX8	128MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSSOP	VSSOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL
Programming voltage	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	0.7 mm	0.7 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL
type	SLC NAND TYPE	SLC NAND TYPE
width	12 mm	12 mm

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