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K9F1G08U0A-VCB00

Description
Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48
Categorystorage    storage   
File Size873KB,36 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K9F1G08U0A-VCB00 Overview

Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48

K9F1G08U0A-VCB00 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeSOIC
package instruction12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time18 ns
Other featuresCONTAINS ADDITIONAL 32M BIT NAND FLASH
JESD-30 codeR-PDSO-G48
length15.4 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals48
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height0.7 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeSLC NAND TYPE
width12 mm
K9F1G08R0A
K9F1G08U0A K9K2G08U1A
Preliminary
FLASH MEMORY
Document Title
128M x 8 Bit / 256M x 8 Bit
NAND Flash Memory
Revision History
Revision No
0.0
0.1
History
1. Initial issue
1. The tADL(Address to Data Loading Time) is added.
- tADL Minimum 100ns (Page 11, 23~26)
- tADL is the time from the WE rising edge of final address cycle
to the WE rising edge of first data cycle at program operation.
2. Added Addressing method for program operation
Draft Date
Aug. 24. 2003
Jan. 27. 2004
Remark
Advance
Preliminary
0.2
0.3
0.4
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(TSOP1, WSOP1) Dimension Change
1. Technical note is changed
2. Notes of AC timing characteristics are added
3. The description of Copy-back program is changed
4. Voltage range is changed
-1.7V~1.95V -> 1.65V~1.95V
5. Note2 of Command Sets is added
1. CE access time : 23ns->35ns (p.11)
Apr. 23. 2004
May. 19. 2004
Jan. 21. 2005
Preliminary
Preliminary
Preliminary
Feb. 14. 2005
0.5
Preliminary
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near your office.
1

K9F1G08U0A-VCB00 Related Products

K9F1G08U0A-VCB00 K9F1G08U0A-FCB00
Description Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48 Flash, 128MX8, 18ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48
Maker SAMSUNG SAMSUNG
Parts packaging code SOIC SOIC
package instruction 12 X 17 MM, 0.70 MM PITCH, PLASTIC, WSOP1-48 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48
Contacts 48 48
Reach Compliance Code unknown compliant
ECCN code 3A991.B.1.A 3A991.B.1.A
Maximum access time 18 ns 18 ns
Other features CONTAINS ADDITIONAL 32M BIT NAND FLASH CONTAINS ADDITIONAL 32M BIT NAND FLASH
JESD-30 code R-PDSO-G48 R-PDSO-G48
length 15.4 mm 15.4 mm
memory density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
memory width 8 8
Number of functions 1 1
Number of terminals 48 48
word count 134217728 words 134217728 words
character code 128000000 128000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 128MX8 128MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSSOP VSSOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V
Certification status Not Qualified Not Qualified
Maximum seat height 0.7 mm 0.7 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm
Terminal location DUAL DUAL
type SLC NAND TYPE SLC NAND TYPE
width 12 mm 12 mm

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