GS840H32B-180I datasheet, PDF - EEWORLD Datasheet

GS840H32B-180I: DescriptionCache SRAM, 128KX32, 8ns, CMOS, PBGA119, BGA-119; Categorystorage storage; File Size626KB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS840H32B-180I Overview

Cache SRAM, 128KX32, 8ns, CMOS, PBGA119, BGA-119

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	BGA,
Contacts	119
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Maximum access time	8 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	4194304 bit
Memory IC Type	CACHE SRAM
memory width	32
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX32
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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