Silicon monolithic integrated circuits
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ROHM Semiconductor |
Parts packaging code | TSSOP |
package instruction | HVSSOP, TSOP44,.36,32 |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Commercial integrated circuit types | AUDIO AMPLIFIER |
harmonic distortion | 0.1% |
JESD-30 code | R-PDSO-G44 |
JESD-609 code | e2 |
length | 18.5 mm |
Number of channels | 2 |
Number of functions | 1 |
Number of terminals | 44 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Nominal output power | 17 W |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVSSOP |
Encapsulate equivalent code | TSOP44,.36,32 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 12 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum slew rate | 50 mA |
Maximum supply voltage (Vsup) | 16.5 V |
Minimum supply voltage (Vsup) | 10 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Copper (Sn/Cu) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.5 mm |