S-29394ADPA datasheet, PDF - EEWORLD Datasheet

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S-29394ADPA: DescriptionEEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8; Categorystorage storage; File Size206KB，44 Pages; ManufacturerABLIC

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S-29394ADPA Overview

EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8

S-29394ADPA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ABLIC
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	DATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	10
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.3 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	16
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/6.5 V
Certification status	Not Qualified
Maximum seat height	4.5 mm
Serial bus type	MICROWIRE
Maximum standby current	4e-7 A
Maximum slew rate	0.0025 mA
Maximum supply voltage (Vsup)	6.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE/SOFTWARE

S-29394ADPA Related Products

	S-29394ADPA	S-29394AFJA	S-29394AFJ	S-29394ADP	S-29194AFJA	S-29294AFJ	S-29294ADPA
Description	EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8	EEPROM, 64X16, Serial, CMOS, PDSO8, SOP1-8	EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC
Parts packaging code	DIP	SOIC	SOIC	DIP	SOIC	SOIC	DIP
package instruction	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3
Contacts	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
Data retention time - minimum	10	10	10	10	10	10	10
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	9.3 mm	5.02 mm	4.9 mm	9.5 mm	5.02 mm	4.9 mm	9.3 mm
memory density	4096 bit	4096 bit	4096 bit	4096 bit	1024 bit	2048 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	256 words	256 words	256 words	256 words	64 words	128 words	128 words
character code	256	256	256	256	64	128	128
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256X16	256X16	256X16	256X16	64X16	128X16	128X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP8,.3	SOP8,.25	SOP8,.25	DIP8,.3	SOP8,.25	SOP8,.25	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/6.5 V	1.8/6.5 V	1.8/6.5 V	1.8/6.5 V	1.8/6.5 V	1.8/6.5 V	1.8/6.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.5 mm	1.75 mm	1.75 mm	3.94 mm	1.75 mm	1.75 mm	4.5 mm
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	3-WIRE	MICROWIRE
Maximum standby current	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A
Maximum slew rate	0.0025 mA	0.0025 mA	0.0025 mA	0.0025 mA	0.0025 mA	0.0025 mA	0.0025 mA
Maximum supply voltage (Vsup)	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	1.8 V	1.8 V	2.5 V	1.8 V	2.5 V
Nominal supply voltage (Vsup)	5 V	5 V	2.5 V	2.5 V	5 V	2.5 V	5 V
surface mount	NO	YES	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	3.9 mm	3.9 mm	7.62 mm	3.9 mm	3.9 mm	7.62 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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