EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | ABLIC |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | DATA RETENTION: 10 YEARS |
Maximum clock frequency (fCLK) | 2 MHz |
Data retention time - minimum | 10 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 5.02 mm |
memory density | 4096 bit |
Memory IC Type | EEPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 256 words |
character code | 256 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256X16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8/6.5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Serial bus type | MICROWIRE |
Maximum standby current | 4e-7 A |
Maximum slew rate | 0.0025 mA |
Maximum supply voltage (Vsup) | 6.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE/SOFTWARE |
S-29394AFJA | S-29394AFJ | S-29394ADPA | S-29394ADP | S-29194AFJA | S-29294AFJ | S-29294ADPA | |
---|---|---|---|---|---|---|---|
Description | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, SOP1-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
Parts packaging code | SOIC | SOIC | DIP | DIP | SOIC | SOIC | DIP |
package instruction | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Other features | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS | DATA RETENTION: 10 YEARS |
Maximum clock frequency (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
Data retention time - minimum | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 5.02 mm | 4.9 mm | 9.3 mm | 9.5 mm | 5.02 mm | 4.9 mm | 9.3 mm |
memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 1024 bit | 2048 bit | 2048 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 256 words | 256 words | 256 words | 256 words | 64 words | 128 words | 128 words |
character code | 256 | 256 | 256 | 256 | 64 | 128 | 128 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 256X16 | 256X16 | 256X16 | 256X16 | 64X16 | 128X16 | 128X16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | DIP | DIP | SOP | SOP | DIP |
Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V | 1.8/6.5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.75 mm | 4.5 mm | 3.94 mm | 1.75 mm | 1.75 mm | 4.5 mm |
Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | 3-WIRE | MICROWIRE |
Maximum standby current | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A |
Maximum slew rate | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA | 0.0025 mA |
Maximum supply voltage (Vsup) | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
Minimum supply voltage (Vsup) | 2.5 V | 1.8 V | 2.5 V | 1.8 V | 2.5 V | 1.8 V | 2.5 V |
Nominal supply voltage (Vsup) | 5 V | 2.5 V | 5 V | 2.5 V | 5 V | 2.5 V | 5 V |
surface mount | YES | YES | NO | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 3.9 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |