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S-29394ADP

Description
EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8
Categorystorage    storage   
File Size206KB,44 Pages
ManufacturerABLIC
Download Datasheet Parametric Compare View All

S-29394ADP Overview

EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8

S-29394ADP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerABLIC
Parts packaging codeDIP
package instructionDIP, DIP8,.3
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresDATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK)2 MHz
Data retention time - minimum10
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.5 mm
memory density4096 bit
Memory IC TypeEEPROM
memory width16
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X16
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8/6.5 V
Certification statusNot Qualified
Maximum seat height3.94 mm
Serial bus typeMICROWIRE
Maximum standby current4e-7 A
Maximum slew rate0.0025 mA
Maximum supply voltage (Vsup)6.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Maximum write cycle time (tWC)10 ms
write protectHARDWARE/SOFTWARE

S-29394ADP Related Products

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Description EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8 EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 EEPROM, 64X16, Serial, CMOS, PDSO8, SOP1-8 EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker ABLIC ABLIC ABLIC ABLIC ABLIC ABLIC ABLIC
Parts packaging code DIP SOIC SOIC DIP SOIC SOIC DIP
package instruction DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP8,.25 DIP, DIP8,.3
Contacts 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS DATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK) 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz 2 MHz
Data retention time - minimum 10 10 10 10 10 10 10
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 9.5 mm 5.02 mm 4.9 mm 9.3 mm 5.02 mm 4.9 mm 9.3 mm
memory density 4096 bit 4096 bit 4096 bit 4096 bit 1024 bit 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 256 words 256 words 256 words 256 words 64 words 128 words 128 words
character code 256 256 256 256 64 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256X16 256X16 256X16 256X16 64X16 128X16 128X16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP SOP SOP DIP
Encapsulate equivalent code DIP8,.3 SOP8,.25 SOP8,.25 DIP8,.3 SOP8,.25 SOP8,.25 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.8/6.5 V 1.8/6.5 V 1.8/6.5 V 1.8/6.5 V 1.8/6.5 V 1.8/6.5 V 1.8/6.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.94 mm 1.75 mm 1.75 mm 4.5 mm 1.75 mm 1.75 mm 4.5 mm
Serial bus type MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE 3-WIRE MICROWIRE
Maximum standby current 4e-7 A 4e-7 A 4e-7 A 4e-7 A 4e-7 A 4e-7 A 4e-7 A
Maximum slew rate 0.0025 mA 0.0025 mA 0.0025 mA 0.0025 mA 0.0025 mA 0.0025 mA 0.0025 mA
Maximum supply voltage (Vsup) 6.5 V 6.5 V 6.5 V 6.5 V 6.5 V 6.5 V 6.5 V
Minimum supply voltage (Vsup) 1.8 V 2.5 V 1.8 V 2.5 V 2.5 V 1.8 V 2.5 V
Nominal supply voltage (Vsup) 2.5 V 5 V 2.5 V 5 V 5 V 2.5 V 5 V
surface mount NO YES YES NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 3.9 mm 3.9 mm 7.62 mm 3.9 mm 3.9 mm 7.62 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
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