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PJD2NA60_R2_00001

Description
Power Field-Effect Transistor
CategoryDiscrete semiconductor    The transistor   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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PJD2NA60_R2_00001 Overview

Power Field-Effect Transistor

PJD2NA60_R2_00001 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
package instructionSMALL OUTLINE, R-PSSO-G2
Reach Compliance Codecompliant
ConfigurationSINGLE
Minimum drain-source breakdown voltage600 V
Maximum drain current (ID)2 A
Maximum drain-source on-resistance4.4 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-252AA
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON

PJD2NA60_R2_00001 Preview

PPJU2NA60
/ PJP2NA60 / PJF2NA60 / PJD2NA60
600V N-Channel MOSFET
Voltage
Features
R
DS(ON)
, V
GS
@10V,I
D
@1A<4.4Ω
High switching speed
Improved dv/dt capability
Low Gate Charge
Low reverse transfer capacitance
Lead free in compliance with EU RoHS 2011/65/EU directive.
Green molding compound as per IEC61249 Std.
600 V
Current
2A
(Halogen Free)
Mechanical Data
Case : TO-251AB ,TO-220AB, ITO-220AB, TO-252 Package
Terminals : Solderable per MIL-STD-750, Method 2026
TO-251AB Approx. Weight : 0.0104 ounces, 0.297grams
TO-220AB Approx. Weight : 0.065 ounces, 1.859 grams
ITO-220AB Approx. Weight : 0.056 ounces, 1.6 grams
TO-252 Approx. Weight : 0.0104 ounces, 0.297grams
o
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Single Pulse Avalanche Energy
(Note 1)
Power Dissipation
T
C
=25
o
C
Derate above 25
o
C
SYMBOL
V
DS
V
GS
I
D
I
DM
E
AS
P
D
T
J
,T
STG
34
0.27
44
0.35
-55~150
TO-251AB
TO-220AB
ITO-220AB
TO-252
UNITS
V
V
A
A
mJ
600
+30
2
8
115
23
0.18
34
0.27
W
W/
o
C
o
Operating Junction and
Storage Temperature Range
Thermal resistance
-
-
Junction to Case
Junction to Ambient
C
R
θJC
R
θJA
3.67
110
2.84
62.5
5.43
120
3.67
110
o
C/W
Limited only By Maximum Junction Temperature
March 10,2014-REV.00
Page 1
PPJU2NA60
/ PJP2NA60 / PJF2NA60 / PJD2NA60
Electrical Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
Maximum Pulsed Drain-Source
Diode Forward Current
Reverse Recovery Time
Reverse Recovery Charge
I
S
I
SM
trr
Qrr
---
---
V
GS
=0V, I
S
=2A
dI
F
/ dt=100A/us
(Note 2)
-
-
-
-
-
-
357
2
2
8
-
-
A
A
ns
uC
td
(on)
t
r
td
(off)
t
f
V
DD
=300V, I
D
=2A,
R
G
=25Ω
(Note 2,3)
-
-
-
-
10
24
16
21
-
-
-
-
ns
Q
g
Q
gs
Q
gd
Ciss
Coss
Crss
V
DS
=480V, I
D
=2A,
V
GS
=10V
(Note 2,3)
V
DS
=25V, V
GS
=0V,
f=1.0MHZ
-
-
-
-
-
-
5.7
1.8
2
257
39.7
0.92
-
-
-
-
-
-
pF
nC
BV
DSS
V
GS(th)
R
DS(on)
I
DSS
I
GSS
V
SD
V
GS
=0V,I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
GS
=10V,I
D
=1A
V
DS
=600V,V
GS
=0V
V
GS
=+30V,V
DS
=0V
I
S
=2A,V
GS
=0V
600
2
-
-
-
-
-
3.2
4
0.02
+10
0.86
-
4
4.4
1.0
+100
1.4
V
V
uA
nA
V
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNITS
o
NOTES :
1. L=30mH, I
AS
=2.7A, V
DD
=50V, R
G
=25ohm, Starting T
J
=25
o
C
2. Pulse width<300us, Duty cycle<2%
3. Essentially independent of operating temperature typical characteristics.
March 10,2014-REV.00
Page 2
PPJU2NA60
/ PJP2NA60 / PJF2NA60 / PJD2NA60
TYPICAL CHARACTERISTIC CURVES
Fig.1 Output Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction Temperature
Fig.5 Capacitance vs. Drain-Source Voltage
Fig.6 Source-Drain Diode Forward Voltage
March 10,2014-REV.00
Page 3
PPJU2NA60
/ PJP2NA60 / PJF2NA60 / PJD2NA60
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate Charge
Fig.8 BV
DSS
vs. Junction Temperature
Fig.9
Threshold Voltage Variation with Temperature
Fig.10 Maximum Safe Operating Area
Fig.11 Maximum Safe Operating Area
Fig.12 Maximum Safe Operating Area
March 10,2014-REV.00
Page 4
PPJU2NA60
/ PJP2NA60 / PJF2NA60 / PJD2NA60
TYPICAL CHARACTERISTIC CURVES
Fig.13 PJU/PJD Normalized Transient Thermal Impedance vs. Pulse Width
Fig.14 PJP2NA60 Normalized Transient Thermal Impedance vs. Pulse Width
Fig.15 PJF2NA60 Normalized Transient Thermal Impedance vs. Pulse Width
March 10,2014-REV.00
Page 5
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