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HSMP-3894-BLKG

Description
100V, SILICON, PIN DIODE, LEAD FREE PACKAGE-3
CategoryDiscrete semiconductor    diode   
File Size283KB,13 Pages
ManufacturerAVAGO
Websitehttp://www.avagotech.com/
Environmental Compliance  
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HSMP-3894-BLKG Overview

100V, SILICON, PIN DIODE, LEAD FREE PACKAGE-3

HSMP-3894-BLKG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAVAGO
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
applicationSWITCHING
Minimum breakdown voltage100 V
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Maximum diode capacitance0.3 pF
Nominal diode capacitance0.2 pF
Diode component materialsSILICON
Maximum diode forward resistance2.5 Ω
Diode resistance test current1 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee4
Minority carrier nominal lifetime0.2 µs
Humidity sensitivity level1
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Reverse test voltage5 V
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HSMP-389x Series, HSMP-489x Series
Surface Mount RF PIN Switch Diodes
Data Sheet
Description/Applications
The HSMP-389x series is optimized for switching appli-
cations where low resistance at low current and low ca-
pacitance are required. The HSMP-489x series products
feature ultra low parasitic inductance. These products
are specifically designed for use at frequencies which
are much higher than the upper limit for conventional
PIN diodes.
Features
Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Switching
– Low Capacitance
– Low Resistance at Low Current
Low Failure in Time (FIT) Rate
[1]
Pin Connections and Package Marking
1
6
Matched Diodes for Consistent Performance
Better Thermal Conductivity for Higher Power
Dissipation
Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
GUx
2
3
5
4
Notes:
1. Package marking provides orientation, identification, and date
code.
2. See “Electrical Specifications” for appropriate package marking.
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