EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

PCA9557DBG4

Description
Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,36 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Related ProductsFound20parts with similar functions to PCA9557DBG4
Stay tuned Parametric Compare

PCA9557DBG4 Online Shopping

Suppliers Part Number Price MOQ In stock  
PCA9557DBG4 - - View Buy Now

PCA9557DBG4 Overview

Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander

PCA9557DBG4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSSOP, SSOP16,.3
Contacts16
Reach Compliance Codecompli
ECCN codeEAR99
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length6.2 mm
Humidity sensitivity level1
Number of digits8
Number of I/O lines8
Number of ports1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply2.5/5 V
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage5.5 V
Minimum supply voltage2.3 V
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width5.3 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE

PCA9557DBG4 Related Products

PCA9557DBG4 PCA9557DBRG4 PCA9557DRG4 PCA9557DG4 BJL36070 PCA9557DGVRG4G4 PCA9557PWG4 PCA9557PWTG4 PCA9557RGVRG4 PCA9557RGYRG4
Description Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander PowerPact B Circuit Breaker, 70A, 3P, 600Y/347V AC, 25kA at 600Y/347 UL EverLink Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander Remote 8-Bit I2C and SMBus Low-Power I/O Expander with Reset and Configuration Registers 16-VQFN -40 to 85 Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander
Is it lead-free? Lead free Lead free Lead free Lead free - Lead free Lead free Lead free - Lead free
Is it Rohs certified? conform to conform to conform to conform to - conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC SOIC SOIC SOIC - SOIC TSSOP TSSOP QFN QFN
package instruction SSOP, SSOP16,.3 SSOP, SSOP16,.3 SOP, SOP16,.25 SOP, SOP16,.25 - TSSOP, TSSOP16,.25,16 TSSOP, TSSOP16,.25 TSSOP, TSSOP16,.25 HVQCCN, LCC16,.16SQ,25 HVQCCN, LCC16/20,.14X.16,20
Contacts 16 16 16 16 - 16 16 16 16 16
Reach Compliance Code compli compli compli compli - compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 - R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 S-PQCC-N16 R-PQCC-N16
JESD-609 code e4 e4 e4 e4 - e4 e4 e4 e4 e4
length 6.2 mm 6.2 mm 9.9 mm 9.9 mm - 4.4 mm 5 mm 5 mm 4 mm 4 mm
Humidity sensitivity level 1 1 1 1 - 1 1 1 2 2
Number of digits 8 8 8 8 - 8 8 8 8 8
Number of I/O lines 8 8 8 8 - 8 8 8 8 8
Number of ports 1 1 1 1 - 1 1 1 1 1
Number of terminals 16 16 16 16 - 16 16 16 16 16
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP SSOP SOP SOP - TSSOP TSSOP TSSOP HVQCCN HVQCCN
Encapsulate equivalent code SSOP16,.3 SSOP16,.3 SOP16,.25 SOP16,.25 - TSSOP16,.25,16 TSSOP16,.25 TSSOP16,.25 LCC16,.16SQ,25 LCC16/20,.14X.16,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 - 260 260 260 260 260
power supply 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V - 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 2 mm 1.75 mm 1.75 mm - 1.2 mm 1.2 mm 1.2 mm 1 mm 1 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V - 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES - YES YES YES YES YES
technology CMOS CMOS CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING - GULL WING GULL WING GULL WING NO LEAD NO LEAD
Terminal pitch 0.65 mm 0.65 mm 1.27 mm 1.27 mm - 0.4 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL - DUAL DUAL DUAL QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 5.3 mm 5.3 mm 3.9 mm 3.9 mm - 3.6 mm 4.4 mm 4.4 mm 4 mm 3.5 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE - PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE

PCA9557DBG4 Similar Products

Part Number Manufacturer Description
PCA9557DB Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus Low-Power I/O Expander with Reset and Configuration Registers 16-SSOP -40 to 85
PCA9557DBRG4 Texas Instruments(德州仪器) Interface - I/O Expanders Rem 8B I2C & SMBus Low-Pwr I/O Expander
PCA9557DBT Texas Instruments(德州仪器) 8 I/O, PIA-GENERAL PURPOSE, PDSO16, PLASTIC, SSOP-16
PCA9538PWG4 Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus Low-Power I/O Expander With Interrupt Output, Reset, and Config Registers 16-TSSOP -40 to 85
PCA9554PWRG4 Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus I/O Expander with Interrupt Output and Configuration Registers 16-TSSOP -40 to 85
PCA9534APW Texas Instruments(德州仪器) Remote 8-Bit I2C and Low-Power I/O Expander With Interrupt Output and Configuration Registers 16-TSSOP -40 to 85
MAX7329AAP+ Rochester Electronics 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 5.30 MM, LEAD FREE, MO150, SSOP-20
PCA9538DB Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus Low-Power I/O Expander With Interrupt Output, Reset, and Config Registers 16-SSOP -40 to 85
PCA9534PW,118 NXP(恩智浦) PCA9534 - 8-bit I2C-bus and SMBus low power I/O port with interrupt TSSOP 16-Pin
PCA9554ADGVR Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus I/O Expander with Interrupt Output and Configuration Registers 16-TVSOP -40 to 85
PCA9534RGVR Texas Instruments(德州仪器) Remote 8-Bit I2C and Low-Power I/O Expander With Interrupt Output and Configuration Registers 16-VQFN -40 to 85
PCA9554APW,118 NXP(恩智浦) I/O的数量:8 特性:POR 接口:I²C, SMBus 时钟频率:400kHz
TCA9554PWR Texas Instruments(德州仪器)
PCA9554ADBR Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus I/O Expander with Interrupt Output and Configuration Registers 16-SSOP -40 to 85
PCA9534PWR Texas Instruments(德州仪器) I/O的数量:8 特性:POR 接口:I²C, SMBus 时钟频率:400kHz I/O扩展器 I2C SMBus
PCA9554BBSHP NXP(恩智浦) Interface - I/O Expanders 8b I2C/SMBus IO Port I2C Fixed Address
PCA9554BPWJ NXP(恩智浦) I2C/SMBus Interface 100kHz/400kHz 5.5V 16-Pin TSSOP T/R
PCA9534ADGVR Texas Instruments(德州仪器) Remote 8-Bit I2C and Low-Power I/O Expander With Interrupt Output and Configuration Registers 16-TVSOP -40 to 85
PCF8574DWRG4 Texas Instruments(德州仪器) Remote 8-Bit I/O Expander for I2C-Bus 16-SOIC -40 to 85
PCA9554ADW Texas Instruments(德州仪器) Remote 8-Bit I2C and SMBus I/O Expander with Interrupt Output and Configuration Registers 16-SOIC -40 to 85
【ESP32-S2-Kaluga-1 Review】Getting weather information via https
Get weather information through https. I chose the interface of Hefeng Weather as the weather source, which uses https. Since I just started using IDF and am not very familiar with network and encrypt...
ID.LODA Domestic Chip Exchange
LE audio, Bluetooth positioning, Bluetooth mesh... Where will the next technological explosion point of Bluetooth be? ?
Bluetooth is a solution-oriented technology with four main application directions: audio transmission (such as wireless headphones, wireless speakers, and car systems), data transmission (sports and f...
okhxyyo RF/Wirelessly
RAM is equivalent to the computer's running memory. Can the memory stick also be expanded?
1. Both EEPROM and flash can be plug-in, for example, 24W128 and WQ256, what is the difference?2. RAM is equivalent to computer running memory, memory stick, can it also be expanded?...
QWE4562009 Discrete Device
LPS25HB Barometric Pressure Sensor PCB Package and Code
Data sheet:Application note:Official evaluation board gerber file:C code (example):Schematic library:PCB library:...
littleshrimp MEMS sensors
Can the glass fiber effect be quantified through simulation?
Original article by Mr. Gaosu, the self-media of YiBo Technology | Huang GangThe glass fiber effect is a somewhat suspenseful probabilistic event. Its suspense is manifested in that it will occur unde...
yvonneGan PCB Design
In Cadence, I want to reserve space for components in PCB design. How do I do it in the principle?
In Cadence, I want to reserve the position of components in the PCB design. How can I do it in the schematic to achieve the purpose of reservation? For example, the components in the figure below, I j...
小太阳yy Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号