Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | LCC |
| package instruction | CERAMIC, LCC-52 |
| Contacts | 52 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 45 ns |
| Other features | AUTOMATIC POWER-DOWN; INTERRUPT FLAG |
| I/O type | COMMON |
| JESD-30 code | S-CQCC-N52 |
| JESD-609 code | e0 |
| length | 19.05 mm |
| memory density | 8192 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 52 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC52,.75SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 2.54 mm |
| Maximum standby current | 0.015 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.05 mm |
| Base Number Matches | 1 |
| CY7C131-45LMB | CY7C141-45LMB | CY7C141-55LMB | |||||||
|---|---|---|---|---|---|---|---|---|---|
| Description | Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52 | Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC52, CERAMIC, LCC-52 | Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC52, CERAMIC, LCC-52 | ||||||
| Is it lead-free? | Contains lead | Contains lead | Contains lead | ||||||
| Is it Rohs certified? | incompatible | incompatible | incompatible | ||||||
| Parts packaging code | LCC | LCC | LCC | ||||||
| package instruction | CERAMIC, LCC-52 | CERAMIC, LCC-52 | CERAMIC, LCC-52 | ||||||
| Contacts | 52 | 52 | 52 | ||||||
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | ||||||
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | ||||||
| Maximum access time | 45 ns | 45 ns | 55 ns | ||||||
| Other features | AUTOMATIC POWER-DOWN; INTERRUPT FLAG | AUTOMATIC POWER-DOWN; INTERRUPT FLAG | AUTOMATIC POWER-DOWN; INTERRUPT FLAG | ||||||
| I/O type | COMMON | COMMON | COMMON | ||||||
| JESD-30 code | S-CQCC-N52 | S-CQCC-N52 | S-CQCC-N52 | ||||||
| JESD-609 code | e0 | e0 | e0 | ||||||
| length | 19.05 mm | 19.05 mm | 19.05 mm | ||||||
| memory density | 8192 bit | 8192 bit | 8192 bit | ||||||
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | ||||||
| memory width | 8 | 8 | 8 | ||||||
| Number of functions | 1 | 1 | 1 | ||||||
| Number of ports | 2 | 2 | 2 | ||||||
| Number of terminals | 52 | 52 | 52 | ||||||
| word count | 1024 words | 1024 words | 1024 words | ||||||
| character code | 1000 | 1000 | 1000 | ||||||
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ||||||
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | ||||||
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | ||||||
| organize | 1KX8 | 1KX8 | 1KX8 | ||||||
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | ||||||
| Exportable | YES | YES | YES | ||||||
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | ||||||
| encapsulated code | QCCN | QCCN | QCCN | ||||||
| Encapsulate equivalent code | LCC52,.75SQ | LCC52,.75SQ | LCC52,.75SQ | ||||||
| Package shape | SQUARE | SQUARE | SQUARE | ||||||
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | ||||||
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | ||||||
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | ||||||
| power supply | 5 V | 5 V | 5 V | ||||||
| Certification status | Not Qualified | Not Qualified | Not Qualified | ||||||
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | ||||||
| Maximum seat height | 2.54 mm | 2.54 mm | 2.54 mm | ||||||
| Maximum standby current | 0.015 A | 0.015 A | 0.015 A | ||||||
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | ||||||
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | ||||||
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | ||||||
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | ||||||
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | ||||||
| surface mount | YES | YES | YES | ||||||
| technology | CMOS | CMOS | CMOS | ||||||
| Temperature level | MILITARY | MILITARY | MILITARY | ||||||
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | ||||||
| Terminal form | NO LEAD | NO LEAD | NO LEAD | ||||||
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | ||||||
| Terminal location | QUAD | QUAD | QUAD | ||||||
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | ||||||
| width | 19.05 mm | 19.05 mm | 19.05 mm | ||||||
| Maker | - | Cypress Semiconductor | Cypress Semiconductor |
51mcu
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