Division’s state of the art, double-molded vertical
construction packaging to produce one of the world’s
smallest relays. The CPC2014N offers substantial
board space savings over the competitor’s larger 8-Pin
SOIC relay.
Features
•
Designed for use in Security Systems Complying
with EN50130-4
•
1500V
rms
Input/Output Isolation
•
TTL/CMOS Compatible Input
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Immune to Radiated EM Fields
•
SMD Pick & Place, Wave Solderable
•
Tape & Reel Version Available
•
Small 8-Pin SOIC Package
Approvals
•
UL Certified Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Applications
•
Security
•
Passive Infrared Detectors (PIR)
•
Data Signalling
•
Sensor Circuitry
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Medical Equipment—Patient/Equipment Isolation
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
CPC2014N
CPC2014NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Pin Configuration
1
+ Control
2
– Control
3
+ Control
4
– Control
5
Load
6
Load
7
Load
8
Load
Switching Characteristics
of Normally Open (Form A) Devices
Form-A
I
F
90%
Pb
DS-CPC2014N-R03
e
3
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I
LOAD
t
on
10%
t
off
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25°C
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation
1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
CPC2014N
Ratings
60
5
50
1
70
600
1500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 5mW / ºC
Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Capacitance, Input to Output
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
I
F
=2mA
t <10ms
I
L
=400mA
V
L
=60V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
-
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
-
0.47
0.22
40
1
0.25
0.2
1.2
-
400
±1
2
1
2
1
-
-
2
-
1.4
10
mA
rms
/ mA
DC
A
P
µA
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
-
I
L
=400mA
-
I
F
=5mA
V
R
=5V
ms
pF
pF
mA
mA
V
µA
I
F
I
F
V
F
I
R
Load current derates linearly from 400mA @ 25
o
C to 200mA @80
o
C, and must be derated for both poles operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60
o
C) a LED drive current of 4mA is recommended.
2
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IRCUITS
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IVISION
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
25
20
15
10
5
0
1.250
1.255 1.260 1.265 1.270
LED Forward Voltage (V)
1.275
0.35
0.40
0.45 0.50 0.55
Turn-On (ms)
0.60
0.65
CPC2014N
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
30
25
Device Count (N)
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
Device Count (N)
Device Count (N)
0.55
0.65
0.75
0.85
Turn-Off (ms)
0.95
1.05
25
Device Count (N)
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=400mA, T
A
=25ºC)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=400mA, T
A
=25ºC)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=1mA, I
L
=400mA, T
A
=25ºC)
Device Count (N)
Device Count (N)
0.16
0.18
0.20
0.22
0.24
LED Current (mA)
0.26
0.16
0.18
0.20 0.22 0.24
LED Current (mA)
0.26
0.28
0.505 0.510 0.515 0.520 0.525 0.530 0.535
On-Resistance ( )
35
30
Device Count (N)
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
63.5
64.0
64.5 65.0 65.5 66.0
Blocking Voltage (V
P
)
66.5
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
1.0
-40
I
F
=10mA
I
F
=5mA
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
Turn-On (ms)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-On vs. LED Forward Current
(I
L
=80mA)
0.7
0.6
Turn-Off (ms)
0.5
0.4
0.3
0.2
0.1
0
Typical Turn-Off vs. LED Forward Current
(I
L
=80mA)
0
5
10
15
20
25
30
35
40
45
50
0
5
LED Forward Current (mA)
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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3
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NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA*
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
CPC2014N
Typical Turn-On vs. Temperature
(I
L
=80mA)
I
F
=5mA
I
F
=10mA
-20
0
20
40
60
80
100
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-40
Typical Turn-Off vs. Temperature
(I
L
=80mA)
0.9
0.8
On-Resistance ( )
0.7
Typical On-Resistance vs. Temperature
(I
L
=200mA)
I
F
=5mA
I
F
=10mA
Steady State
Turn-On (ms)
Turn-Off (ms)
0.6
0.5
0.4
0.3
-40
-20
0
20
40
60
80
100
I
F
=5mA
I
F
=10mA
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
0.36
0.32
0.28
0.24
0.20
0.16
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA)
0.36
0.32
0.28
0.24
0.20
0.16
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA)
Load Current (mA)
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
500
400
300
200
100
0
-100
-200
-300
-400
-500
-0.3
Typical Load Current vs. Load Voltage
with One Pole Operating
(I
F
=2mA)
LED Current (mA)
LED Current (mA)
-0.2
-0.1
0.0
0.1
0.2
0.3
Load Voltage (V)
500
Load Current (mA)
400
300
200
100
0
Maximum Load Current vs. Temperature
with One Pole Operating
(I
F
=2mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
72
70
Leakage (µA)
68
66
64
62
60
58
-40
-20
0
20
40
60
80
100
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
Typical Leakage vs. Temperature
Measured Across Pins 5&6 and 7&8
(V
L
=60V)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
Temperature (ºC)
20
40
60
Temperature (ºC)
80
100
1100
1000
900
800
700
600
500
400
300
200
100
0
10 s 100 s 1ms 10ms 100ms
Time
Energy Rating Curve
(I
F
=2mA)
Load Current (mA)
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
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NTEGRATED
C
IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
CPC2014N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC2014N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC2014N
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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