CL8064701526902/SR18B datasheet, PDF

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CL8064701526902/SR18B: DescriptionRISC Microprocessor, 64-Bit, 2000MHz, CMOS; CategoryThe embedded processor and controller Microcontrollers and processors; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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CL8064701526902/SR18B Overview

RISC Microprocessor, 64-Bit, 2000MHz, CMOS

CL8064701526902/SR18B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	, BGA1168(UNSPEC)
Reach Compliance Code	compliant
bit size	64
Number of terminals	1168
Package body material	PLASTIC/EPOXY
Encapsulate equivalent code	BGA1168(UNSPEC)
power supply	1.8 V
Certification status	Not Qualified
speed	2000 MHz
Maximum slew rate	40000 mA
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Mobile 4th Generation Intel

Core

™

Processor Family, Mobile Intel

Pentium

Processor Family, and

Mobile Intel

Celeron

Processor

Family

Datasheet – Volume 1 of 2

Supporting 4th Generation Intel

Core

™

processor based on Mobile

U-Processor and Y-Processor Lines

Supporting Mobile Intel

Pentium

and Mobile Intel

Celeron

Processor Families

December 2013

Order No.: 329001-005

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death.

SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND

ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL

CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF

PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL

OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or

characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no

responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without

notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

This document contains information on products in the design phase of development.

Code Names are only for use by Intel to identify products, platforms, programs, services, etc. ("products") in development by Intel that have not been

made commercially available to the public, i.e., announced, launched or shipped. They are never to be used as "commercial" names for products. Also,

they are not intended to function as trademarks.

For Enhanced Intel SpeedStep

Technology, see the Processor Spec Finder at

http://ark.intel.com/

or contact your Intel representative for more

information.

Intel

AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct

sequence. AES-NI is available on select Intel

processors. For availability, consult your reseller or system manufacturer. For more information, see

http://software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/.

Intel

Hyper-Threading Technology (Intel

HT Technology) is available on select Intel

Core

™

processors. It requires an Intel

HT Technology enabled

system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. Not available on Intel

Core

™

i5-750. For more information including details on which processors support Intel

HT Technology, visit

http://www.intel.com/info/hyperthreading.

Intel

64 architecture requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific

hardware and software you use. Consult your PC manufacturer for more information. For more information, visit

http://www.intel.com/

content/www/us/en/architecture-and-technology/microarchitecture/intel-64-architecture-general.html.

No computer system can provide absolute security under all conditions. Intel

Trusted Execution Technology (Intel

TXT) requires a computer with

Intel

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured

launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit

http://www.intel.com/technology/

security.

Intel

Virtualization Technology (Intel

VT) requires a computer system with an enabled Intel

processor, BIOS, and virtual machine monitor (VMM).

Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be

compatible with all operating systems. Consult your PC manufacturer. For more information, visit

http://www.intel.com/go/virtualization.

Requires a system with Intel

Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select

Intel

processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more

information, visit

http://www.intel.com/go/turbo.

Requires activation and a system with a corporate network connection, an Intel

AMT-enabled chipset, network hardware and software. For notebooks,

Intel AMT may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered

off. Results dependent upon hardware, setup and configuration.

Intel, Intel Core, Celeron, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others.

Mobile 4th Generation Intel

Core

™

Processor Family, Mobile Intel

Pentium

Processor Family, and Mobile Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

December 2013

Order No.: 329001-005

Contents—Processors

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Supported Technologies.........................................................................................11

Power Management Support...................................................................................12

Thermal Management Support................................................................................12

Package Support...................................................................................................13

Processor Testability............................................................................................. 13

Terminology.........................................................................................................13

Related Documents............................................................................................... 16

2.0 Interfaces................................................................................................................... 17

2.1 System Memory Interface...................................................................................... 17

2.1.1 System Memory Technology Supported.......................................................17

2.1.2 System Memory Timing Support................................................................. 19

2.1.3 System Memory Organization Modes........................................................... 19

2.1.4 System Memory Frequency........................................................................ 20

2.1.5 Intel

Fast Memory Access (Intel

FMA) Technology Enhancements............... 20

2.1.6 Data Scrambling...................................................................................... 21

2.1.7 DRAM Clock Generation............................................................................. 21

2.1.8 DRAM Reference Voltage Generation........................................................... 21

2.2 Processor Graphics................................................................................................22

2.3 Processor Graphics Controller (GT)..........................................................................22

2.3.1 3D and Video Engines for Graphics Processing.............................................. 22

2.4 Digital Display Interface (DDI)................................................................................24

2.5 Platform Environmental Control Interface (PECI)....................................................... 29

2.5.1 PECI Bus Architecture................................................................................29

3.0 Technologies............................................................................................................... 31

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 31

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 35

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 36

3.4 Intel

Turbo Boost Technology 2.0..........................................................................37

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................37

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................38

3.7 Intel

64 Architecture x2APIC................................................................................ 38

3.8 Power Aware Interrupt Routing (PAIR).................................................................... 40

3.9 Execute Disable Bit............................................................................................... 40

3.10 Intel

Boot Guard............................................................................................... 40

3.11 Supervisor Mode Execution Protection (SMEP)........................................................40

3.12 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)... 41

4.0 Power Management.................................................................................................... 42

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 43

4.2 Processor Core Power Management......................................................................... 44

4.2.1 Enhanced Intel

SpeedStep

Technology Key Features..................................44

4.2.2 Low-Power Idle States............................................................................... 45

4.2.3 Requesting Low-Power Idle States...............................................................46

4.2.4 Core C-State Rules....................................................................................46

Mobile 4th Generation Intel

Core

™

Processor Family, Mobile Intel

Pentium

Processor Family, and Mobile Intel

Celeron

Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 329001-005

Processors—Contents

4.2.5 Package C-States......................................................................................48

4.2.6 Package C-States and Display Resolutions.................................................... 51

4.3 Integrated Memory Controller (IMC) Power Management............................................53

4.3.1 Disabling Unused System Memory Outputs................................................... 53

4.3.2 DRAM Power Management and Initialization..................................................53

4.3.3 DDR Electrical Power Gating (EPG).............................................................. 56

4.4 Graphics Power Management..................................................................................56

4.4.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................56

4.4.2 Graphics Render C-State............................................................................56

4.4.3 Intel

Smart 2D Display Technology (Intel

S2DDT)..................................... 56

4.4.4 Intel

Graphics Dynamic Frequency............................................................ 57

4.4.5 Intel

Display Power Saving Technology (Intel

DPST)................................. 57

4.4.6 Intel

Automatic Display Brightness ........................................................... 57

4.4.7 Intel

Seamless Display Refresh Rate Technology (Intel

SDRRS

Technology)............................................................................................ 58

5.0 Thermal Management................................................................................................. 59

5.1 Thermal Considerations......................................................................................... 59

5.2 Intel

Turbo Boost Technology 2.0 Power Monitoring.................................................60

5.3 Intel

Turbo Boost Technology 2.0 Power Control..................................................... 60

5.3.1 Package Power Control.............................................................................. 60

5.3.2 Turbo Time Parameter............................................................................... 61

5.4 Configurable TDP (cTDP) and Low-Power Mode......................................................... 61

5.4.1 Configurable TDP...................................................................................... 61

5.4.2 Low-Power Mode.......................................................................................62

5.5 Thermal and Power Specifications........................................................................... 62

5.6 Thermal Management Features............................................................................... 65

5.6.1 Adaptive Thermal Monitor.......................................................................... 65

5.6.2 Digital Thermal Sensor.............................................................................. 67

5.6.3 PROCHOT# Signal.....................................................................................68

5.6.4 On-Demand Mode..................................................................................... 70

5.6.5 Intel

Memory Thermal Management.......................................................... 70

5.6.6 Scenario Design Power (SDP)..................................................................... 71

6.0 Signal Description....................................................................................................... 72

6.1 System Memory Interface Signals........................................................................... 72

6.2 Memory Compensation and Miscellaneous Signals..................................................... 75

6.3 Reset and Miscellaneous Signals............................................................................. 76

6.4 embedded DisplayPort* (eDP*) Signals....................................................................77

6.5 Display Interface Signals....................................................................................... 77

6.6 Testability Signals.................................................................................................77

6.7 Error and Thermal Protection Signals....................................................................... 78

6.8 Power Sequencing Signals......................................................................................79

6.9 Processor Power Signals........................................................................................ 79

6.10 Sense Signals..................................................................................................... 80

6.11 Ground and Non-Critical to Function (NCTF) Signals.................................................80

6.12 Processor Internal Pull-Up / Pull-Down Terminations................................................ 80

7.0 Electrical Specifications.............................................................................................. 82

7.1 Integrated Voltage Regulator..................................................................................82

7.2 Power and Ground Pins..........................................................................................82

7.3 V

Voltage Identification (VID).............................................................................. 82

Mobile 4th Generation Intel

Core

™

Processor Family, Mobile Intel

Pentium

Processor Family, and Mobile Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

December 2013

Order No.: 329001-005

CL8064701526902/SR18B Related Products

	CL8064701526902/SR18B	CL8064701463101/SR16M	CL8064701462901/SR16J	CL8064701477202/SR16Z	CL8064701558501/SR191	CL8064701558601/SR192	CL8064701512402/SR1DC	CL8064701462800/SR16H
Description	RISC Microprocessor, 64-Bit, 2000MHz, CMOS	RISC Microprocessor, 64-Bit, 2600MHz, CMOS	RISC Microprocessor, 64-Bit, 3000MHz, CMOS	RISC Microprocessor, 64-Bit, 3000MHz, CMOS	RISC Microprocessor, 64-Bit, 1900MHz, CMOS	RISC Microprocessor, 64-Bit, 2300MHz, CMOS	RISC Microprocessor, 64-Bit, 1500MHz, CMOS	RISC Microprocessor, 64-Bit, 3300MHz, CMOS
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compli	compli	compli	compliant	compliant	compliant	compli
bit size	64	64	64	64	64	64	64	64
Number of terminals	1168	1168	1168	1168	1168	1168	1168	1168
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)	BGA1168(UNSPEC)
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	2000 MHz	2600 MHz	3000 MHz	3000 MHz	1900 MHz	2300 MHz	1500 MHz	3300 MHz
Maximum slew rate	40000 mA	32000 mA	32000 mA	32000 mA	25000 mA	25000 mA	25000 mA	32000 mA
Nominal supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
package instruction	, BGA1168(UNSPEC)	, BGA1168(UNSPEC)	, BGA1168(UNSPEC)	, BGA1168(UNSPEC)	, BGA1168(UNSPEC)	-	, BGA1168(UNSPEC)	-
Base Number Matches	1	1	1	1	1	1	1	-

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