UPD41102C-3 datasheet, PDF - EEWORLD Datasheet

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UPD41102C-3: DescriptionIC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC; Categorystorage storage; File Size554KB，13 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD41102C-3 Overview

IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC

UPD41102C-3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	unknown
Maximum access time	21 ns
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
Memory IC Type	MEMORY CIRCUIT
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.09 A
Maximum slew rate	0.09 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

UPD41102C-3 Related Products

	UPD41102C-3	UPD41102C-1	UPD41102C-1S	UPD41102C-2	UPD41102G-1	UPD41102G-1S
Description	IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC	IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC	IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC	IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC	IC,FIELD/FRAME/LINE MEMORY,CMOS,SOP,24PIN,PLASTIC	IC,FIELD/FRAME/LINE MEMORY,CMOS,SOP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	21 ns	40 ns	27 ns	21 ns	40 ns	27 ns
JESD-30 code	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDSO-G24	R-PDSO-G24
JESD-609 code	e0	e0	e0	e0	e0	e0
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
Number of terminals	24	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	SOP24,.5	SOP24,.5
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.09 A	0.09 A	0.09 A	0.09 A	0.09 A	0.09 A
Maximum slew rate	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA	0.09 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1

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