IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| Maximum access time | 40 ns |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| Memory IC Type | MEMORY CIRCUIT |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.09 A |
| Maximum slew rate | 0.09 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| UPD41102C-1 | UPD41102C-1S | UPD41102C-2 | UPD41102C-3 | UPD41102G-1 | UPD41102G-1S | |
|---|---|---|---|---|---|---|
| Description | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | IC,FIELD/FRAME/LINE MEMORY,CMOS,SOP,24PIN,PLASTIC | IC,FIELD/FRAME/LINE MEMORY,CMOS,SOP,24PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 40 ns | 27 ns | 21 ns | 21 ns | 40 ns | 27 ns |
| JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | SOP | SOP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.5 | SOP24,.5 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.09 A | 0.09 A | 0.09 A | 0.09 A | 0.09 A | 0.09 A |
| Maximum slew rate | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
Power technology
MCU
RF/Wirelessly
Power technology
Test/Measurement
Embedded System
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