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ISPLSI5384-100LB388

Description
EE PLD, 13ns, 384-Cell, CMOS, PBGA388,
CategoryProgrammable logic devices    Programmable logic   
File Size2MB,28 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Download Datasheet Parametric Compare View All

ISPLSI5384-100LB388 Overview

EE PLD, 13ns, 384-Cell, CMOS, PBGA388,

ISPLSI5384-100LB388 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLattice
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other featuresYES
In-system programmableYES
JESD-30 codeS-PBGA-B388
JESD-609 codee0
JTAG BSTYES
Humidity sensitivity level3
Number of macro cells384
Number of terminals388
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA388,26X26,50
Package shapeSQUARE
Package formGRID ARRAY
power supply2.5/3.3,3.3 V
Programmable logic typeEE PLD
propagation delay13 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Base Number Matches1

ISPLSI5384-100LB388 Related Products

ISPLSI5384-100LB388 ISPLSI5384-100LB272
Description EE PLD, 13ns, 384-Cell, CMOS, PBGA388, EE PLD, 13ns, 384-Cell, CMOS, PBGA272,
Is it Rohs certified? incompatible incompatible
Maker Lattice Lattice
Reach Compliance Code not_compliant compliant
ECCN code EAR99 EAR99
Other features YES YES
In-system programmable YES YES
JESD-30 code S-PBGA-B388 S-PBGA-B272
JESD-609 code e0 e0
JTAG BST YES YES
Number of macro cells 384 384
Number of terminals 388 272
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA388,26X26,50 BGA272,20X20,50
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Programmable logic type EE PLD EE PLD
propagation delay 13 ns 13 ns
Certification status Not Qualified Not Qualified
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Base Number Matches 1 1
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