IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
Maximum access time | 150 ns |
I/O type | COMMON |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
memory density | 65536 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Programming voltage | 12.5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
NMC27C64N15 | NMC27C64BN250 | NMC27C64BQ120 | NMC27C64BQ150 | NMC27C64BQE120 | NMC27C64BQE150 | NMC27C64BQE200 | |
---|---|---|---|---|---|---|---|
Description | IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant |
Maximum access time | 150 ns | 250 ns | 120 ns | 150 ns | 120 ns | 150 ns | 200 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
Memory IC Type | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Programming voltage | 12.5 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V | 12.75 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |