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NMC27C64N15

Description
IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC
Categorystorage    storage   
File Size311KB,9 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

NMC27C64N15 Overview

IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC

NMC27C64N15 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP28,.6
Reach Compliance Codeunknown
Maximum access time150 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
memory density65536 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals28
word count8192 words
character code8000
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Programming voltage12.5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

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Description IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC IC,EPROM,8KX8,CMOS,DIP,28PIN,PLASTIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknown compliant compliant compliant compliant compliant compliant
Maximum access time 150 ns 250 ns 120 ns 150 ns 120 ns 150 ns 200 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T28 R-PDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type OTP ROM OTP ROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8
Number of terminals 28 28 28 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12.5 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V 12.75 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
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