MC14094BDR2 datasheet, PDF - EEWORLD Datasheet

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MC14094BDR2: DescriptionIC,SHIFT REGISTER,CMOS,SOP,16PIN,PLASTIC; Categorylogic logic; File Size693KB，10 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14094BDR2 Overview

IC,SHIFT REGISTER,CMOS,SOP,16PIN,PLASTIC

MC14094BDR2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	SOP, SOP16,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Number of digits	8
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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MC14094BDR2 Related Products

	MC14094BDR2	MC14094BCPD	MC14094BALD	MC14094BCLD	MC14094BCLDS	MC14094BCP
Description	IC,SHIFT REGISTER,CMOS,SOP,16PIN,PLASTIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of digits	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	YES	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	-	-	NXP	NXP	NXP	NXP

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