CD40107BEX98 datasheet, PDF - EEWORLD Datasheet

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CD40107BEX98: DescriptionNAND Gate, CMOS, PDIP8,; Categorylogic logic; File Size234KB，3 Pages; ManufacturerRCA

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CD40107BEX98 Overview

NAND Gate, CMOS, PDIP8,

CD40107BEX98 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TAPE AND REEL
power supply	5/15 V
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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CD40107BEX98 Related Products

	CD40107BEX98	CD40107BEX	CD40107BE98	CD40107BD/3W	CD40107BD/3	CD40107BFX	CD40107BF/3W	CD40107BF/3
Description	NAND Gate, CMOS, PDIP8,	NAND Gate, CMOS, PDIP8,	NAND Gate, CMOS, PDIP8,	NAND Gate, CMOS, CDIP14	NAND Gate, CMOS, CDIP14	NAND Gate, CMOS, CDIP14,	NAND Gate, CMOS, CDIP14	NAND Gate, CMOS, CDIP14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-PDIP-T8	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of terminals	8	8	8	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO	NO
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	-	-	-
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified

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