|
BSN20 |
934012500235 |
934012500215 |
BSN20/T1 |
Description |
173mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
173mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
173mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
173mA, 50V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB, PLASTIC PACKAGE-3 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
NXP |
Reach Compliance Code |
compliant |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Other features |
LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
50 V |
50 V |
50 V |
50 V |
Maximum drain current (ID) |
0.173 A |
0.173 A |
0.173 A |
0.173 A |
Maximum drain-source on-resistance |
20 Ω |
20 Ω |
20 Ω |
20 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
Maximum feedback capacitance (Crss) |
8 pF |
8 pF |
8 pF |
8 pF |
JESD-30 code |
R-PDSO-G3 |
R-PDSO-G3 |
R-PDSO-G3 |
R-PDSO-G3 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of components |
1 |
1 |
1 |
1 |
Number of terminals |
3 |
3 |
3 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
150 °C |
150 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
YES |
YES |
YES |
YES |
Terminal surface |
Tin (Sn) |
TIN |
TIN |
TIN |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
40 |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |