FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28
Parameter Name | Attribute value |
Maker | TEMIC |
package instruction | CERAMIC, DIP-28 |
Reach Compliance Code | unknown |
Maximum access time | 80 ns |
Other features | RETRANSMIT |
period time | 100 ns |
JESD-30 code | R-GDIP-T28 |
memory density | 73728 bit |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX9 |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
Base Number Matches | 1 |
5962-9167701XA | 5962-9167702XX | 5962-9167701XX | 5962-9167701ZC | 5962-9167702ZX | 5962-9167701ZX | 5962-9167702XA | |
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Description | FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 8KX9, 80ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 50ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 80ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32 | FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 |
package instruction | CERAMIC, DIP-28 | CERAMIC, DIP-28 | CERAMIC, DIP-28 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, LCC-32 | CERAMIC, DIP-28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 80 ns | 50 ns | 80 ns | 80 ns | 50 ns | 80 ns | 50 ns |
Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
period time | 100 ns | 65 ns | 100 ns | 100 ns | 65 ns | 100 ns | 65 ns |
JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T28 |
memory density | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 32 | 32 | 32 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 |
Exportable | NO | NO | NO | NO | NO | NO | NO |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP | DIP | QCCN | QCCN | QCCN | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maker | TEMIC | - | TEMIC | TEMIC | TEMIC | TEMIC | TEMIC |