5962-9167701XX datasheet, PDF - EEWORLD Datasheet

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5962-9167701XX: DescriptionFIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size187KB，25 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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5962-9167701XX Overview

FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28

5962-9167701XX Parametric

Parameter Name	Attribute value
Maker	TEMIC
package instruction	CERAMIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	80 ns
Other features	RETRANSMIT
period time	100 ns
JESD-30 code	R-GDIP-T28
memory density	73728 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Base Number Matches	1

5962-9167701XX Related Products

	5962-9167701XX	5962-9167702XX	5962-9167701XA	5962-9167701ZC	5962-9167702ZX	5962-9167701ZX	5962-9167702XA
Description	FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 8KX9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28	FIFO, 8KX9, 80ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 8KX9, 50ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 8KX9, 80ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	FIFO, 8KX9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28
package instruction	CERAMIC, DIP-28	CERAMIC, DIP-28	CERAMIC, DIP-28	CERAMIC, LCC-32	CERAMIC, LCC-32	CERAMIC, LCC-32	CERAMIC, DIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	80 ns	50 ns	80 ns	80 ns	50 ns	80 ns	50 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
period time	100 ns	65 ns	100 ns	100 ns	65 ns	100 ns	65 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-GDIP-T28
memory density	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit	73728 bit
memory width	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	32	32	32	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9	8KX9
Exportable	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	QCCN	QCCN	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
Maker	TEMIC	-	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC

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