0.1 A, SILICON, SIGNAL DIODE
CMDSH-3 | CDRH3D16-220 | ELJPC220KF | LQH3C220 | SM8237 | LEM2520-220 | LB2012B220M | CMDSH2-3 | BAT54 | |
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Description | 0.1 A, SILICON, SIGNAL DIODE | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 0.2 A, 30 V, SILICON, SIGNAL DIODE |
Rated inductance | - | 22 µH | 22 µH | 22 µH | 22 µH | 22 µH | - | 22 µH | - |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | - | 1 | - |
Number of terminals | - | 2 | 2 | 2 | 2 | 2 | - | 2 | 3 |
Minimum operating temperature | - | -20 Cel | -20 Cel | -20 Cel | -20 Cel | -20 Cel | - | -20 Cel | - |
Maximum operating temperature | - | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | - | 85 Cel | - |
self resonant frequency | - | 18 MHz | 18 MHz | 18 MHz | 18 MHz | 18 MHz | - | 18 MHz | - |
Processing package description | - | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | - | CHIP, 1008, ROHS COMPLIANT | ROHS COMPLIANT, PLASTIC PACKAGE-3 |
EU RoHS regulations | - | Yes | Yes | Yes | Yes | Yes | - | Yes | - |
state | - | EOL | EOL | EOL | EOL | EOL | - | EOL | ACTIVE |
Inductor type | - | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | - | GENERAL PURPOSE INDUCTOR | - |
case_size_code | - | 1008 | 1008 | 1008 | 1008 | 1008 | - | 1008 | - |
structure | - | Molded Chip | Molded Chip | Molded Chip | Molded Chip | Molded Chip | - | Molded Chip | single |
core material | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | - |
DC Resistance | - | 4 ohm | 4 ohm | 4 ohm | 4 ohm | 4 ohm | - | 4 ohm | - |
Inductor applications | - | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | - | RF INDUCTOR | - |
jesd_609_code | - | e2 | e2 | e2 | e2 | e2 | - | e2 | - |
Manufacturer Series | - | PC | PC | PC | PC | PC | - | PC | - |
ckage_heigh | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | - |
ckage_length | - | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | - | 2.5 mm | - |
ckage_style__meter_ | - | SMT | SMT | SMT | SMT | SMT | - | SMT | - |
ckage_width | - | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm | - | 2 mm | - |
cking_method | - | TR | TR | TR | TR | TR | - | TR | - |
1 Minimum quality factor for rated value | - | 20 | 20 | 20 | 20 | 20 | - | 20 | - |
Maximum rated current | - | 0.1600 A | 0.1600 A | 0.1600 A | 0.1600 A | 0.1600 A | - | 0.1600 A | - |
series | - | ELJ-P | ELJ-P | ELJ-P | ELJ-P | ELJ-P | - | ELJ-P | - |
Shape and size description | - | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | - | RECTANGULAR PACKAGE | - |
isolation | - | NO | NO | NO | NO | NO | - | NO | - |
surface mount | - | YES | YES | YES | YES | YES | - | YES | Yes |
terminal coating | - | TIN COPPER | TIN COPPER | TIN COPPER | TIN COPPER | TIN COPPER | - | TIN COPPER | - |
Terminal layout | - | DUAL ENDED | DUAL ENDED | DUAL ENDED | DUAL ENDED | DUAL ENDED | - | DUAL ENDED | - |
Terminal shape | - | J BEND | J BEND | J BEND | J BEND | J BEND | - | J BEND | - |
Test frequency | - | 2.52 MHz | 2.52 MHz | 2.52 MHz | 2.52 MHz | 2.52 MHz | - | 2.52 MHz | - |
deviation | - | 10 % | 10 % | 10 % | 10 % | 10 % | - | 10 % | - |