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CMDSH2-3

Description
1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
CategoryThe sensor   
File Size331KB,14 Pages
ManufacturerSAMHOP
Websitehttp://www.samhop.com.tw
Download Datasheet Parametric Compare View All

CMDSH2-3 Overview

1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

CMDSH2-3 Parametric

Parameter NameAttribute value
Rated inductance22 µH
Number of functions1
Number of terminals2
Minimum operating temperature-20 Cel
Maximum operating temperature85 Cel
self resonant frequency18 MHz
Processing package descriptionCHIP, 1008, ROHS COMPLIANT
EU RoHS regulationsYes
stateEOL
Inductor typeGENERAL PURPOSE INDUCTOR
case_size_code1008
structureMolded Chip
core materialCERAMIC
DC Resistance4 ohm
Inductor applicationsRF INDUCTOR
jesd_609_codee2
Manufacturer SeriesPC
ckage_heigh1.6 mm
ckage_length2.5 mm
ckage_style__meter_SMT
ckage_width2 mm
cking_methodTR
1 Minimum quality factor for rated value20
Maximum rated current0.1600 A
seriesELJ-P
Shape and size descriptionRECTANGULAR PACKAGE
isolationNO
surface mountYES
terminal coatingTIN COPPER
Terminal layoutDUAL ENDED
Terminal shapeJ BEND
Test frequency2.52 MHz
deviation10 %

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Description 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD 0.1 A, SILICON, SIGNAL DIODE 0.2 A, 30 V, SILICON, SIGNAL DIODE
Rated inductance 22 µH 22 µH 22 µH 22 µH 22 µH 22 µH - - -
Number of functions 1 1 1 1 1 1 - - -
Number of terminals 2 2 2 2 2 2 - - 3
Minimum operating temperature -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel -20 Cel - - -
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel - - -
self resonant frequency 18 MHz 18 MHz 18 MHz 18 MHz 18 MHz 18 MHz - - -
Processing package description CHIP, 1008, ROHS COMPLIANT CHIP, 1008, ROHS COMPLIANT CHIP, 1008, ROHS COMPLIANT CHIP, 1008, ROHS COMPLIANT CHIP, 1008, ROHS COMPLIANT CHIP, 1008, ROHS COMPLIANT - - ROHS COMPLIANT, PLASTIC PACKAGE-3
EU RoHS regulations Yes Yes Yes Yes Yes Yes - - -
state EOL EOL EOL EOL EOL EOL - - ACTIVE
Inductor type GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR - - -
case_size_code 1008 1008 1008 1008 1008 1008 - - -
structure Molded Chip Molded Chip Molded Chip Molded Chip Molded Chip Molded Chip - - single
core material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC - - -
DC Resistance 4 ohm 4 ohm 4 ohm 4 ohm 4 ohm 4 ohm - - -
Inductor applications RF INDUCTOR RF INDUCTOR RF INDUCTOR RF INDUCTOR RF INDUCTOR RF INDUCTOR - - -
jesd_609_code e2 e2 e2 e2 e2 e2 - - -
Manufacturer Series PC PC PC PC PC PC - - -
ckage_heigh 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm - - -
ckage_length 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm 2.5 mm - - -
ckage_style__meter_ SMT SMT SMT SMT SMT SMT - - -
ckage_width 2 mm 2 mm 2 mm 2 mm 2 mm 2 mm - - -
cking_method TR TR TR TR TR TR - - -
1 Minimum quality factor for rated value 20 20 20 20 20 20 - - -
Maximum rated current 0.1600 A 0.1600 A 0.1600 A 0.1600 A 0.1600 A 0.1600 A - - -
series ELJ-P ELJ-P ELJ-P ELJ-P ELJ-P ELJ-P - - -
Shape and size description RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE - - -
isolation NO NO NO NO NO NO - - -
surface mount YES YES YES YES YES YES - - Yes
terminal coating TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER - - -
Terminal layout DUAL ENDED DUAL ENDED DUAL ENDED DUAL ENDED DUAL ENDED DUAL ENDED - - -
Terminal shape J BEND J BEND J BEND J BEND J BEND J BEND - - -
Test frequency 2.52 MHz 2.52 MHz 2.52 MHz 2.52 MHz 2.52 MHz 2.52 MHz - - -
deviation 10 % 10 % 10 % 10 % 10 % 10 % - - -
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