Decoder/Driver, TTL, CDFP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54F139/BFA | 54F139/B2A | 54F139/BEA | |
|---|---|---|---|
| Description | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, CQCC20, | Decoder/Driver, TTL, CDIP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| Number of functions | 2 | 2 | 2 |
| Number of terminals | 16 | 20 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | QCCN | DIP |
| Encapsulate equivalent code | FL16,.3 | LCC20,.35SQ | DIP16,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO |
| technology | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 |
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