EBE51FD8AGFN-6E-E datasheet, PDF

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EBE51FD8AGFN-6E-E: Description512MB Fully Buffered DIMM; Categorystorage storage; File Size154KB，22 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en

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EBE51FD8AGFN-6E-E Overview

512MB Fully Buffered DIMM

EBE51FD8AGFN-6E-E Parametric

Parameter Name	Attribute value
Maker	ELPIDA
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
memory density	4831838208 bi
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	64MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	DUAL

EBE51FD8AGFN-6E-E Related Products

	EBE51FD8AGFN-6E-E	EDE5108AGSE-6E-E	EDE5108AGSE-5C-E	EBE51FD8AGFD	EBE51FD8AGFN	EBE51FD8AGFD-6E-E
Description	512MB Fully Buffered DIMM	512MB Fully Buffered DIMM	512MB Fully Buffered DIMM	512MB Fully Buffered DIMM	512MB Fully Buffered DIMM	512MB Fully Buffered DIMM
Maker	ELPIDA	ELPIDA	ELPIDA	-	-	ELPIDA
Parts packaging code	DIMM	BGA	BGA	-	-	DIMM
package instruction	DIMM,	TFBGA, BGA60,9X11,32	TFBGA, BGA60,9X11,32	-	-	DIMM,
Contacts	240	60	60	-	-	240
Reach Compliance Code	unknow	unknow	unknow	-	-	unknow
ECCN code	EAR99	EAR99	EAR99	-	-	EAR99
access mode	SINGLE BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	-	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	-	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-PBGA-B60	R-PBGA-B60	-	-	R-XDMA-N240
memory density	4831838208 bi	536870912 bi	536870912 bi	-	-	4831838208 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM	DDR DRAM	-	-	DDR DRAM MODULE
memory width	72	8	8	-	-	72
Number of functions	1	1	1	-	-	1
Number of ports	1	1	1	-	-	1
Number of terminals	240	60	60	-	-	240
word count	67108864 words	67108864 words	67108864 words	-	-	67108864 words
character code	64000000	64000000	64000000	-	-	64000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	-	-	85 °C
organize	64MX72	64MX8	64MX8	-	-	64MX72
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	UNSPECIFIED
encapsulated code	DIMM	TFBGA	TFBGA	-	-	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	-	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified
self refresh	YES	YES	YES	-	-	YES
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	-	-	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	-	-	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	-	-	1.8 V
surface mount	NO	YES	YES	-	-	NO
technology	CMOS	CMOS	CMOS	-	-	CMOS
Temperature level	OTHER	OTHER	OTHER	-	-	OTHER
Terminal form	NO LEAD	BALL	BALL	-	-	NO LEAD
Terminal location	DUAL	BOTTOM	BOTTOM	-	-	DUAL

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