512MB Fully Buffered DIMM
EBE51FD8AGFD | EDE5108AGSE-6E-E | EDE5108AGSE-5C-E | EBE51FD8AGFN | EBE51FD8AGFD-6E-E | EBE51FD8AGFN-6E-E | |
---|---|---|---|---|---|---|
Description | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM | 512MB Fully Buffered DIMM |
Maker | - | ELPIDA | ELPIDA | - | ELPIDA | ELPIDA |
Parts packaging code | - | BGA | BGA | - | DIMM | DIMM |
package instruction | - | TFBGA, BGA60,9X11,32 | TFBGA, BGA60,9X11,32 | - | DIMM, | DIMM, |
Contacts | - | 60 | 60 | - | 240 | 240 |
Reach Compliance Code | - | unknow | unknow | - | unknow | unknow |
ECCN code | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
access mode | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
Other features | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | - | R-PBGA-B60 | R-PBGA-B60 | - | R-XDMA-N240 | R-XDMA-N240 |
memory density | - | 536870912 bi | 536870912 bi | - | 4831838208 bi | 4831838208 bi |
Memory IC Type | - | DDR DRAM | DDR DRAM | - | DDR DRAM MODULE | DDR DRAM MODULE |
memory width | - | 8 | 8 | - | 72 | 72 |
Number of functions | - | 1 | 1 | - | 1 | 1 |
Number of ports | - | 1 | 1 | - | 1 | 1 |
Number of terminals | - | 60 | 60 | - | 240 | 240 |
word count | - | 67108864 words | 67108864 words | - | 67108864 words | 67108864 words |
character code | - | 64000000 | 64000000 | - | 64000000 | 64000000 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | - | 85 °C | 85 °C | - | 85 °C | 85 °C |
organize | - | 64MX8 | 64MX8 | - | 64MX72 | 64MX72 |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | UNSPECIFIED |
encapsulated code | - | TFBGA | TFBGA | - | DIMM | DIMM |
Package shape | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
Package form | - | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
self refresh | - | YES | YES | - | YES | YES |
Maximum supply voltage (Vsup) | - | 1.9 V | 1.9 V | - | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | - | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V |
surface mount | - | YES | YES | - | NO | NO |
technology | - | CMOS | CMOS | - | CMOS | CMOS |
Temperature level | - | OTHER | OTHER | - | OTHER | OTHER |
Terminal form | - | BALL | BALL | - | NO LEAD | NO LEAD |
Terminal location | - | BOTTOM | BOTTOM | - | DUAL | DUAL |