ML4K-67140L-70 datasheet, PDF - EEWORLD Datasheet

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ML4K-67140L-70: DescriptionMulti-Port SRAM, 1KX8, 70ns, CMOS, CQCC48,; Categorystorage storage; File Size988KB，16 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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ML4K-67140L-70 Overview

Multi-Port SRAM, 1KX8, 70ns, CMOS, CQCC48,

ML4K-67140L-70 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	TEMIC
Reach Compliance Code	unknown
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	S-XQCC-N48
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	MULTI-PORT SRAM
memory width	8
Number of ports	2
Number of terminals	48
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC48,.56SQ,40
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.00002 A
Minimum standby current	2 V
Maximum slew rate	0.08 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	QUAD
Base Number Matches	1

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ML4K-67140L-70 Related Products

	ML4K-67140L-70	MLRD-67140L-70	ML4K-67130L-70	ML4K-67130L-45	ML4K-67140V-45	ML4K-67140V-70	ML4K-67130V-55	ML4K-67130V-45	ML4K-67130L-55	ML4K-67140V-55
Description	Multi-Port SRAM, 1KX8, 70ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 70ns, CMOS, PQFP64,	Multi-Port SRAM, 1KX8, 70ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 70ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC48,	Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC48,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
Maximum access time	70 ns	70 ns	70 ns	45 ns	45 ns	70 ns	55 ns	45 ns	55 ns	55 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-XQCC-N48	S-PQFP-G64	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48	S-XQCC-N48
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bi	8192 bi
Memory IC Type	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
memory width	8	8	8	8	8	8	8	8	8	8
Number of ports	2	2	2	2	2	2	2	2	2	2
Number of terminals	48	64	48	48	48	48	48	48	48	48
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	QFP	QCCN	QCCN	QCCN	QCCN	QCCN	QCCN	QCCN	QCCN
Encapsulate equivalent code	LCC48,.56SQ,40	QFP64,.47SQ,20	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40	LCC48,.56SQ,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.08 mA	0.08 mA	0.08 mA	0.1 mA	0.09 mA	0.07 mA	0.08 mA	0.09 mA	0.09 mA	0.08 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	GULL WING	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD

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