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GD54HCT174J

Description
D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,
Categorylogic    logic   
File Size253KB,6 Pages
ManufacturerLG Semicon Co., Ltd.
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GD54HCT174J Overview

D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,

GD54HCT174J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLG Semicon Co., Ltd.
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeD FLIP-FLOP
Maximum Frequency@Nom-Sup28000000 Hz
MaximumI(ol)0.004 A
Number of functions6
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE
Base Number Matches1

GD54HCT174J Related Products

GD54HCT174J GD54HC174J GD74HCT174J GD74HCT174 GD74HCT174D GD74HC174D GD74HC174J
Description D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDIP16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDSO16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDSO16, D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Maximum Frequency@Nom-Sup 28000000 Hz 20000000 Hz 22000000 Hz 22000000 Hz 22000000 Hz 25000000 Hz 25000000 Hz
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Number of functions 6 6 6 6 6 6 6
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -55 °C -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP SOP SOP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 SOP16,.25 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
power supply 5 V 2/6 V 5 V 5 V 5 V 2/6 V 2/6 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
Maker LG Semicon Co., Ltd. - LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd.
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 - - SOP, SOP16,.25 DIP, DIP16,.3
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V - -
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