GD54HC174J datasheet, PDF - EEWORLD Datasheet

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GD54HC174J: DescriptionD Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,; Categorylogic logic; File Size253KB，6 Pages; ManufacturerLG Semicon Co., Ltd.

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GD54HC174J Overview

D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,

GD54HC174J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D FLIP-FLOP
Maximum Frequency@Nom-Sup	20000000 Hz
MaximumI(ol)	0.004 A
Number of functions	6
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	POSITIVE EDGE
Base Number Matches	1

GD54HC174J Related Products

	GD54HC174J	GD54HCT174J	GD74HCT174J	GD74HCT174	GD74HCT174D	GD74HC174D	GD74HC174J
Description	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDIP16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDSO16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, PDSO16,	D Flip-Flop, 6-Func, Positive Edge Triggered, CMOS, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Maximum Frequency@Nom-Sup	20000000 Hz	28000000 Hz	22000000 Hz	22000000 Hz	22000000 Hz	25000000 Hz	25000000 Hz
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	6	6	6	6	6	6	6
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
power supply	2/6 V	5 V	5 V	5 V	5 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	-	-	SOP, SOP16,.25	DIP, DIP16,.3
Maker	-	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	5 V	-	-

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