EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

LMP2016MMX

Description
IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size460KB,16 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

LMP2016MMX Overview

IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier

LMP2016MMX Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Parts packaging codeSOIC
package instructionTSSOP, TSSOP8,.19
Contacts8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Nominal Common Mode Rejection Ratio130 dB
frequency compensationYES
Maximum input offset voltage10 µV
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
low-biasYES
low-dissonanceYES
micropowerNO
Humidity sensitivity level1
Number of functions2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
powerNO
power supply3/5 V
Programmable powerNO
Certification statusNot Qualified
Maximum seat height1.09 mm
Nominal slew rate4 V/us
Maximum slew rate3 mA
Supply voltage upper limit5.8 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Nominal Uniform Gain Bandwidth3000 kHz
Minimum voltage gain17780
broadbandNO
width3 mm

LMP2016MMX Related Products

LMP2016MMX LMP2016MA LMP2016MAX LMP2016MM LMP2016MME
Description IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier IC DUAL OP-AMP, 10 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8, MSOP-8, Operational Amplifier
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Parts packaging code SOIC SOIC SOIC SOIC SOIC
package instruction TSSOP, TSSOP8,.19 SOP, SOP8,.25 SOP, SOP8,.25 TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.19
Contacts 8 8 8 8 8
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Nominal Common Mode Rejection Ratio 130 dB 130 dB 130 dB 130 dB 130 dB
frequency compensation YES YES YES YES YES
Maximum input offset voltage 10 µV 10 µV 10 µV 10 µV 10 µV
JESD-30 code S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 S-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0
length 3 mm 4.9 mm 4.9 mm 3 mm 3 mm
low-bias YES YES YES YES YES
low-dissonance YES YES YES YES YES
micropower NO NO NO NO NO
Humidity sensitivity level 1 1 1 1 1
Number of functions 2 2 2 2 2
Number of terminals 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP SOP TSSOP TSSOP
Encapsulate equivalent code TSSOP8,.19 SOP8,.25 SOP8,.25 TSSOP8,.19 TSSOP8,.19
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL RAIL TAPE AND REEL TAPE AND REEL TAPE AND REEL
power NO NO NO NO NO
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Programmable power NO NO NO NO NO
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.09 mm 1.75 mm 1.75 mm 1.09 mm 1.09 mm
Nominal slew rate 4 V/us 4 V/us 4 V/us 4 V/us 4 V/us
Maximum slew rate 3 mA 3 mA 3 mA 3 mA 3 mA
Supply voltage upper limit 5.8 V 5.8 V 5.8 V 5.8 V 5.8 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Nominal Uniform Gain Bandwidth 3000 kHz 3000 kHz 3000 kHz 3000 kHz 3000 kHz
Minimum voltage gain 17780 17780 17780 17780 17780
broadband NO NO NO NO NO
width 3 mm 3.9 mm 3.9 mm 3 mm 3 mm
4G/5GDTU/router, ZigBee module, WIF, Bluetooth wireless transmission characteristics and applications
1. 4G/5GDTU/router, it is a wireless unlimited distance remote transmission method, it is based on the network of the three major operators for data transmission, supports public network transmission ...
蓝先生 RF/Wirelessly
Wireless Communication Principles and Applications (Second Edition Chinese Edition)
"Wireless Communication Principles and Applications" (2nd Edition) is an authoritative and up-to-date textbook on wireless communication technology and system design. Since the first edition was publi...
arui1999 Download Centre
Miller Effect in MOSFET Gate Drive
The waveform of the gate voltage driving the mosfet is shown in the figure. Can anyone help explain the cause of the Miller platform? Thank you! !...
冀秀波 Analog electronics
Unboxing K210 & STM32F7508-DK
The goods that were shipped overseas finally arrived today. Here is a record of the unboxing. 1. Overall unpacking The package I received was quite large, and it was filled with a lot of vacuum filler...
筱笙。。 DigiKey Technology Zone
Common problems and solutions of copper plating technology in PCB process
[i=s]This post was last edited by ohahaha on 2019-3-29 15:44[/i] [align=left][size=4][color=rgb(51, 51, 51)]Electroplated copper is the most widely used pre-plating layer to improve the bonding streng...
ohahaha PCB Design
Cheer for the Olympic athletes - Get the Tokyo Olympic medal table using STM32
Author: wcc149 Source: https://mp.weixin.qq.com/s/gtuy3ad_iutFqlhmIeNjuQThe Tokyo Olympics can be said to be the most special one in the history of the Olympics, postponed for one year, without specta...
okhxyyo DIY/Open Source Hardware

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号